公开(公告)号：JPH1119871A

公开(公告)日：1999-01-26

申请号：JP19983298

申请日：1998-06-30

Applicant: MOTOROLA INC

Inventor： JAMES A GROUTGODE ,  JAMES F BANEL

IPC: B24B55/12 ,  B01D37/00 ,  B01F15/04 ,  H01L21/306

Abstract: PROBLEM TO BE SOLVED: To provide a dilution tool and method reducing vaporization of volatile gas and preventing a hazard exposing a person in the vicinity in hazardous chemicals. SOLUTION: In a dilution tool 100 and a method, in order to remove residue from a semiconductor wafer, a solution is prepared with two fluids. The fluid, for forming the desired solution, is combined in a filter 130. A seal-less pump 141, 142 is driven by a common motor 143, even when a flow amount of the solution is changed, the fluid is pumped out by fixing ratio of each flow amount. Conductivity of the solution, for determining concentration, is measured by a conductivity meter 166.

公开(公告)号：JP2000190201A

公开(公告)日：2000-07-11

申请号：JP35685199

申请日：1999-12-16

Applicant: MOTOROLA INC

Inventor： JAMES F BANEL

IPC: B24B37/04 ,  B24B41/047 ,  B24B53/007 ,  B24B53/12 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To improve polishing uniformity of a semiconductor wafer and flatness of an abrasive pad, by joining first and second support structures respectively having first and second main surfaces through a wave form spring. SOLUTION: A fixing plate 52 that is fixed by a screw 50 having a shoulder and uses a pad conditioner coupling 58 as torque rigidity and a floating plate 55 mutually freely move and mutually take non-same plate attitudes in relation to the vertical direction. A slightly sine-wave-formed wave form spring 54 that is placed between the fixing plate 52 and the floating plate 55 and abuts to the fixing plate 52 and the floating plate 55, when lifting down the pad conditioner coupling 58, non-uniformly compresses a second main surface of the fixing plate 52 in non-parallel with a surface of a polishing medium, and maintains same surface property between a frictional surface of an end effecter 57 and the surface of the polishing medium. In addition, the wave form spring 54 allows a sufficient downward force to be added to the pad conditioner coupling 58.

公开(公告)号：JPH11216666A

公开(公告)日：1999-08-10

申请号：JP31026698

申请日：1998-10-30

Applicant: MOTOROLA INC

Inventor： JAMES F BANEL

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/304 ,  H01L21/306 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a chemical/mechanical flattening device improving reliability in a manufacture environment and a method reducing a cost for polishing each wafer. SOLUTION: A chemical/mechanical flattening device comprises a roller, wafer, carrier, arm, carrier constitutional body, adjusting arm, and an end effect piece. A slurry feed distribution system 51 as constitutional element of the chemical/mechanical flatting device comprises a check valve 52, diaphragm pump 53, check valve 54, back pressure valve 55, and a feed distribution bar 58. In the diaphragm pump 53, an accurate capacity of a abrasive according to each pumping cycle is supplied, without an influence of an input pressure. The check valves 52, 54, prevent a reverse flow of the abrasive through the diaphragm pump 53. In the back pressure valve 55, by preventing a flow of the abrasive during a down stroke of the diaphragm pump 53, a pressure difference in the whole check valve 54 is generated. The abrasive is distributed from the feed distribution bar 58 onto a polishing medium.

公开(公告)号：JPH11224868A

公开(公告)日：1999-08-17

申请号：JP30053898

申请日：1998-10-22

Applicant: MOTOROLA INC

Inventor： JAMES F BANEL ,  TODD W BAREY

IPC: H01L21/304 ,  B24B7/24 ,  B24B37/04 ,  B24B53/00 ,  H01L21/302

Abstract: PROBLEM TO BE SOLVED: To provide a chemical and mechanical planarizing device and a chemi cal and mechanical planarizing method for improving reliability within a manu facture environment and reducing the cost for grinding respective wafers. SOLUTION: This chemical and mechanical planarizing apparatus 81 for reducing a large amount of abrasive material to be used in a wafer grinding process is provided with a cleaning bar 87 for removing the abrasive material and fine particles from a grinding medium and a slurry measurement system 84 for adjusting a pump 83 of a slurry transmission and distribution system. Many slurry transmission and distribution systems are reduced to less than 100 milliliters. Roughly, the minimum capacity of the abrasive material is distributed, so as to grind a single wafer during the grinding process of the respective wafers of a wafer lot. In order to prevent the fixation, aggregation and hardening of the abrasive material during the grinding process of the respective wafers, the slurry transmission and distribution system is purged. A rinse bar performs spraying on the surface of the grinding medium, so as to remove the consumed abrasive material and fine particles before grinding another semiconductor wafer.