公开(公告)号：GB2295624B

公开(公告)日：1998-07-29

申请号：GB9524407

申请日：1995-11-29

Applicant: MOTOROLA INC

Inventor： MEGERA YAROSLAW A ,  SAVIC JOVICA ,  BROWN VERNON L

IPC: C23C18/16 ,  C23C18/28 ,  H05K3/18 ,  C23C18/34 ,  C23C18/38

Abstract: A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu2O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.

公开(公告)号：GB2295624A

公开(公告)日：1996-06-05

申请号：GB9524407

申请日：1995-11-29

Applicant: MOTOROLA INC

Inventor： MEGERA YAROSLAW A ,  SAVIC JOVICA ,  BROWN VERNON L

IPC: C23C18/16 ,  C23C18/28 ,  H05K3/18 ,  C23C18/34 ,  C23C18/38

Abstract: A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board involves exposing the resin A 204 by photo-definition. The resin A 204 contains 10% or less, by weight Cu2O particles 300 mixed uniformly throughout the resin. The circuit board is sprayed with a reduction solution to form catalytic islands 301 predominately of Cu or CuH. The circuit board is then electrolessly plated to form conductors, pads or vias, where the resin A 204 has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing or chelating agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.