Apparatus for cooling an electronic component

    公开(公告)号:AU6692398A

    公开(公告)日:1998-12-30

    申请号:AU6692398

    申请日:1998-03-09

    Applicant: MOTOROLA INC

    Abstract: The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid toward the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.

    METHOD AND APPARATUS FOR UTILIZING HEAT DISSIPATED FROM AN ELECTRICAL DEVICE
    2.
    发明公开
    METHOD AND APPARATUS FOR UTILIZING HEAT DISSIPATED FROM AN ELECTRICAL DEVICE 审中-公开
    方法和装置中使用的热功率损失电气设备的

    公开(公告)号:EP1151457A4

    公开(公告)日:2002-07-03

    申请号:EP99966108

    申请日:1999-12-13

    Applicant: MOTOROLA INC

    Abstract: Embedded electronics (102) are operated under normal operating conditions, with power being supplied to embedded electronics via a power source (205). Heat is generated via the normal operation of the embedded electronics (102), and a voltage (117) is generated via thermionic emission from the heat. The voltage (117) that is generated is supplied to the power source (205) to help power the embedded electronics (102).

    Abstract translation: 嵌入式电子(102)的正常操作条件下操作,其中电源通过电源(205)被供应到嵌入式电子。 热量经由正常操作的嵌入式电子(102)的产生,并且通过从所述热的热电子发射产生电压(117)。 的电压(117)那样,产生供给到所述动力源(205),以帮助功率嵌入式电子(102)。

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