Abstract:
The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid toward the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.
Abstract:
Embedded electronics (102) are operated under normal operating conditions, with power being supplied to embedded electronics via a power source (205). Heat is generated via the normal operation of the embedded electronics (102), and a voltage (117) is generated via thermionic emission from the heat. The voltage (117) that is generated is supplied to the power source (205) to help power the embedded electronics (102).
Abstract:
The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid towards the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.