公开(公告)号：DE69007420D1

公开(公告)日：1994-04-21

申请号：DE69007420

申请日：1990-10-22

Applicant: MOTOROLA INC

Inventor： POLLOCK RANDY

IPC: H01L21/60 ,  H01L21/00 ,  H05K13/00

Abstract: A method for controlling the wire loop height (50) of wires (30,40) above a reference plane installed during the manufacture of an electronic module with a wire bond machine provides for making adjustments based on the wire loop height adjustment resolution of the wire bond machine itself, rather than on an electrical performance specification tolerance for the module.

公开(公告)号：DE4115128C2

公开(公告)日：1999-09-30

申请号：DE4115128

申请日：1991-05-08

Applicant: MOTOROLA INC

Inventor： SANDERS PAUL W ,  POLLOCK RANDY

IPC: H01L23/12 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H01L21/60 ,  H01L23/31

Abstract: A high frequency, low cost power semiconductor device (60) is provided by combining a semiconductor die (46) with a leadframe (10,12) having a coplanar upper surface (36) with thin external leads (18,20) and a thicker central die bond region (24) whose upper face (16) and sides (42) are covered by an encapsulation (52) but whose lower face (54) is exposed. The leadframe (10,12) desirably has an "H" pattern with the arms (18,20) extending laterally from opposed sides of the encapsulation (52) and down-formed to have their lower surfaces (62) coplanar with the exposed lower face (54) of the central die bond region (16,24) which forms the cross-bar of the "H". The leadframe is monolithic and preferably formed by skiving. The device is especially suited for surface-mounting.

公开(公告)号：DE69007420T2

公开(公告)日：1994-08-18

申请号：DE69007420

申请日：1990-10-22

Applicant: MOTOROLA INC

Inventor： POLLOCK RANDY

IPC: H01L21/60 ,  H01L21/00 ,  H05K13/00

Abstract: A method for controlling the wire loop height (50) of wires (30,40) above a reference plane installed during the manufacture of an electronic module with a wire bond machine provides for making adjustments based on the wire loop height adjustment resolution of the wire bond machine itself, rather than on an electrical performance specification tolerance for the module.

公开(公告)号：DE4115128A1

公开(公告)日：1991-11-28

申请号：DE4115128

申请日：1991-05-08

Applicant: MOTOROLA INC

Inventor： SANDERS PAUL W ,  POLLOCK RANDY

IPC: H01L23/12 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34

Abstract: A high frequency, low cost power semiconductor device (60) is provided by combining a semiconductor die (46) with a leadframe (10,12) having a coplanar upper surface (36) with thin external leads (18,20) and a thicker central die bond region (24) whose upper face (16) and sides (42) are covered by an encapsulation (52) but whose lower face (54) is exposed. The leadframe (10,12) desirably has an "H" pattern with the arms (18,20) extending laterally from opposed sides of the encapsulation (52) and down-formed to have their lower surfaces (62) coplanar with the exposed lower face (54) of the central die bond region (16,24) which forms the cross-bar of the "H". The leadframe is monolithic and preferably formed by skiving. The device is especially suited for surface-mounting.