公开(公告)号：FR2726205B1

公开(公告)日：1997-09-26

申请号：FR9511552

申请日：1995-10-02

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  B05D5/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.

公开(公告)号：FR2726205A1

公开(公告)日：1996-05-03

申请号：FR9511552

申请日：1995-10-02

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  B05D5/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.

公开(公告)号：DE19540122C2

公开(公告)日：1997-08-21

申请号：DE19540122

申请日：1995-10-27

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  C23C18/54 ,  C23C18/38

Abstract: PROBLEM TO BE SOLVED: To generate catalytic islands around a small granular metal oxide and to form a sufficient quantity of solid copper thereon by a method, wherein a conductor, a via or a pad exposes a resin and a small granular metal oxide on the surface thereof at a required part, before a circuit board is immersed into a reducing solution. SOLUTION: A two derivative continuous processing board is reduced for 5 min in a solution of 1.0 mol. hydrogenated boron and 0.25 mol. EDTA. The substrate is then cleaned with deionized water and immersed into ion palladium solution for 10 seconds. Subsequently, it is cleaned with deionized water and left as it is for 2 minutes in an electroless bath. According to the method, the deriving time is shortened, while increasing the density at the bonding part and the size of copper particle plating the conductors, pads and vias on a circuit board can be reduced.

公开(公告)号：SG30446A1

公开(公告)日：1996-06-01

申请号：SG1995001622

申请日：1995-10-21

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  BROWN VERNON L ,  MAGERA YAROSLAW A

IPC: G03C20060101 ,  G03C

公开(公告)号：DE19540122A1

公开(公告)日：1996-05-02

申请号：DE19540122

申请日：1995-10-27

Applicant: MOTOROLA INC

Inventor： RICHARDS DAVID R ,  MAGERA YAROSLAW A ,  BROWN VERNON L

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/18 ,  C23C18/54 ,  C23C18/38

Abstract: A method for decreasing the initiation time of an electroless bath involves exposing a plurality of small metal oxide particles contained in a resin defining a surface. The surface is then treated with reducing solution which results in catalytic islands forming around the metal oxide particles and is then treated with a noble metal salt solution of a concentration less than 0.1 molar. This results in a fine layer of noble metal on top of the catalytic islands and protects the islands from oxidation. The surface is the placed in an electroless bath. It has been found that the initiation time in the electroless bath has been reduced from fifteen minutes to less than two minutes.