公开(公告)号：AU2003221814A1

公开(公告)日：2003-10-27

申请号：AU2003221814

申请日：2003-04-02

Applicant: MOTOROLA INC

Inventor： ESTES JOHN C ,  ZHAO LEI ,  PAVIO ANTHONY M ,  THOMPSON WILLIAM J

IPC: H01P5/02 ,  H03H7/38 ,  H01P5/00

Abstract: A stripline integrated circuit apparatus comprising a first ground plane, a stripline section positioned on the first ground plane, the stripline section including N stripline regions where N is a whole number greater than or equal to one, wherein each stripline region includes a stripline sandwiched therebetween a first dielectric layer with a thickness and a second dielectric layer with a thickness where each adjacent stripline is connected in parallel, wherein each adjacent stripline region is separated by a ground plane, a second ground plane positioned on the stripline region, and wherein the plurality of stripline sections are formed and electrically connected in series. The distances between the striplines and the ground planes are adjusted to vary the input and output impedance.