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公开(公告)号：JPH1070405A
公开(公告)日：1998-03-10
申请号：JP16497897
申请日：1997-06-05
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M
IPC: H01L21/822 , H01L27/04 , H01P7/08 , H01P11/00
Abstract: PROBLEM TO BE SOLVED: To provide a high Q factor by providing a substrate having a 1st dielectric constant and an insulating layer, which is positioned on the substrate and has a 2nd dielectric constant, making the 2nd dielectric constant lower than the 1st dielectric constant and positioning a conductive layer on the insulating layer. SOLUTION: A conductive layer 14 is positioned under conductive layers 11-13 adjacently to a lower face 18 of a substrate 15 and operated as the ground face of a semiconductor element 10. Besides, it is made almost parallel to the conductive layer 11 and a front face 17 of the substrate 15. When an insulating layer 16 is made of a low-loss material or its dielectric constant is lower than that of the substrate 15 and the thickness of the insulating layer 16 corresponds to the height joining the conductive layer 14 and the substrate 15, at the element 10, the conductive layer 11 is formed sufficiently wide, the impedance of the layer 11 is lowered, and the Q factor of the element 10 is increased. Since the dielectric constant of the insulating layer 16 is lower than that of the substrate 15, the entire dielectric constant between the conductive layers 11 and 14 can be lowered so that the Q factor of the element 10 can be increased.
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公开(公告)号：DE69730561D1
公开(公告)日：2004-10-14
申请号：DE69730561
申请日：1997-06-05
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M
IPC: H01L21/822 , H01L27/04 , H01P7/08 , H01P11/00
Abstract: A resonator includes a substrate (15) having a first dielectric constant, an insulative layer (16, 31) overlying the substrate (15) and having a second dielectric constant wherein the second dielectric constant is lower than the first dielectric constant, and a electrically conductive layer (11) overlying the insulative layer (16, 31). The resonator has a higher "Q" factor than the prior art.
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公开(公告)号：AU2003240504A1
公开(公告)日：2003-12-31
申请号：AU2003240504
申请日：2003-06-03
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M , ZHAO LEI
IPC: H01P9/00
Abstract: A constant "R" network distributed amplifier formed in a multi-layer, low temperature co fired ceramic structure comprises multiple cascaded constant "R" networks for amplifying a signal applied thereto. Each one of the multiple cascaded constant "R" networks is formed in the ceramic structure and includes a plurality of ceramic layers each of which have a top and bottom planar surfaces which, when bonded together form the ceramic structure. A transmission line is formed on the top surfaces of each of the ceramic layers having a beginning end and a distal end and has a generally rectangular shape. The distal end of the transmission line formed on a lower ceramic layer is connected to the beginning end of the transmission line formed on the next adjacent upper ceramic layer by way of vias formed in the ceramic layers through which metal conductive material is formed there through. The transmission lines and the capacitance established between the individual layers form a LC structure. An output is provided at the middle portion of the transmission line formed on the middle ceramic layer that is coupled to the drain of a FET.
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公开(公告)号：AU2002244110A1
公开(公告)日：2002-10-28
申请号：AU2002244110
申请日：2002-02-20
Applicant: MOTOROLA INC
Inventor： ZHAO LEI , PAVIO ANTHONY M
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公开(公告)号：DE69730561T2
公开(公告)日：2005-09-15
申请号：DE69730561
申请日：1997-06-05
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M
IPC: H01L21/822 , H01L27/04 , H01P7/08 , H01P11/00
Abstract: A resonator includes a substrate (15) having a first dielectric constant, an insulative layer (16, 31) overlying the substrate (15) and having a second dielectric constant wherein the second dielectric constant is lower than the first dielectric constant, and a electrically conductive layer (11) overlying the insulative layer (16, 31). The resonator has a higher "Q" factor than the prior art.
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Patent Agency Ranking
公开(公告)号：AU2003265286A1
公开(公告)日：2004-02-23
申请号：AU2003265286
申请日：2003-07-18
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M , ZHAO LEI
Abstract: A hybrid low voltage distributed power amplifier structure (300) provides improved efficiency by forming drain transmission line inductors (323) on a substrate (306) while the rest of the amplifier is built in IC form (302). A wirebond interconnection (330) is made between the IC's drainline capacitors (324) and the substrate's drainline inductors (323) which are a higher impedance point in the circuit. As a result, the wirebond inductance becomes negligible and has little or no impact on the power amplifier's performance.
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公开(公告)号：AU2003265287A1
公开(公告)日：2004-02-16
申请号：AU2003265287
申请日：2003-07-18
Applicant: MOTOROLA INC
Inventor： THOMPSON WILLIAM JOHN , PAVIO ANTHONY M , ZHAO LEI , ESTES JOHN C
IPC: H01P5/02
Abstract: A broadband impedance matching integrated circuit apparatus comprising an alternating current ground plane, a direct current ground plane positioned proximate to the alternating current ground plane, a first conductive transmission line positioned a distance from the alternating current and direct current ground planes, a dielectric material layer with a thickness positioned on the first conductive transmission line, a second conductive transmission line positioned on the dielectric material layer wherein the first and second conductive transmission lines are electrically interconnected to behave as an electromagnetically coupled tapped autotransformer.
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公开(公告)号：DE69610524T2
公开(公告)日：2001-05-17
申请号：DE69610524
申请日：1996-05-30
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M
Abstract: A method for fabricating electronic components such as transformers and inductors having wire windings formed from a metal sheet rather than from manual winding of wire. Grooves (12 and 17) are formed in the surface of a core (11) during a molding process. The core (11) is then covered with an insulating layer and a metal film. Metal windings (13 and 18) are carved with one of several methods that rely on parallel grooves (12 and 17) to isolate and pattern each continuous winding. An additional embodiment describes the use of a second insulating layer (14) and a second metal film (16) to modify a component such that the component operates in re-entrant mode. This additional embodiment widens the operational bandwidth of any electronic component with at least two metal windings such as a transformer or coupled inductors.
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公开(公告)号：AU2003221814A1
公开(公告)日：2003-10-27
申请号：AU2003221814
申请日：2003-04-02
Applicant: MOTOROLA INC
Inventor： ESTES JOHN C , ZHAO LEI , PAVIO ANTHONY M , THOMPSON WILLIAM J
Abstract: A stripline integrated circuit apparatus comprising a first ground plane, a stripline section positioned on the first ground plane, the stripline section including N stripline regions where N is a whole number greater than or equal to one, wherein each stripline region includes a stripline sandwiched therebetween a first dielectric layer with a thickness and a second dielectric layer with a thickness where each adjacent stripline is connected in parallel, wherein each adjacent stripline region is separated by a ground plane, a second ground plane positioned on the stripline region, and wherein the plurality of stripline sections are formed and electrically connected in series. The distances between the striplines and the ground planes are adjusted to vary the input and output impedance.
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公开(公告)号：AU2002340386A1
公开(公告)日：2003-06-10
申请号：AU2002340386
申请日：2002-11-06
Applicant: MOTOROLA INC
Inventor： PAVIO ANTHONY M , MIESEM ROSS A , DAI XUNHU
Abstract: A multilayer ceramic micropump including a monolithic ceramic package formed of a plurality of ceramic layers defining therein an integrated first ball check valve, and a second ball check valve in microfluidic communication with the first ball check valve, and an actuator characterized as actuating a pumping motion, thereby pumping fluids through the first ball check valve and the second ball check valve.
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