公开(公告)号：AU3506700A

公开(公告)日：2000-09-21

申请号：AU3506700

申请日：2000-02-29

Applicant: MOTOROLA INC

Inventor： KELLEY RONALD J ,  PRATT STEVEN DUANE ,  LANDRETH BOBBY DEAN ,  PENNISI ROBERT W ,  MUTHUSWAMY SIVAKUMAR ,  URBISH GLENN F

IPC: H01M8/04 ,  H01M8/06 ,  H01M8/10 ,  H01M8/24

Abstract: The invention provides a device for generating energy, utilizing a fuel cell. Air is freely guided to the fuel cell, while a fuel gas is provided to the fuel cell from a pressurized fuel supply via a regulator. The portable power supply is most applicable to use with handheld electric devices, and contains a fuel storage means (110) for storing a supply of fuel, a fuel delivery means (120) connected to the fuel storage means, an energy conversion device (140) connected to the fuel delivery means for converting the fuel to electricity. The fuel storage means, the fuel delivery means, and the energy conversion device are all contained in a volume less than 500 cubic centimeters.

公开(公告)号：IE69019B1

公开(公告)日：1996-07-24

申请号：IE67591

申请日：1991-02-28

Applicant: MOTOROLA INC

Inventor： SUPPELSA ANTHONY B ,  III WILLIAM B MULLEN ,  URBISH GLENN F

IPC: H01L21/60 ,  H05K1/00 ,  H05K1/03 ,  H05K3/40

Abstract: A selectively releasing runner and substrate assembly 10 comprises a plurality of conductive runners 16 adhered to a substrate 12, a portion 18 of at least some of the conductive runners 16 have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to a predetermined stress.

公开(公告)号：CA2095609C

公开(公告)日：1996-11-26

申请号：CA2095609

申请日：1991-11-21

Applicant: MOTOROLA INC ,  CITIZEN WATCH CO LTD

Inventor： MULLEN WILLIAM B III ,  URBISH GLENN F ,  FREYMAN BRUCE J ,  WALKER MAURO J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01L23/29 ,  H01L23/50

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：CA2095609A1

公开(公告)日：1992-06-22

申请号：CA2095609

申请日：1991-11-21

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM B III ,  URBISH GLENN F ,  FREYMAN BRUCE J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L21/58 ,  H01L21/56 ,  H01L23/29

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：AU647864B2

公开(公告)日：1994-03-31

申请号：AU9163991

申请日：1991-11-21

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM B III ,  URBISH GLENN F ,  FREYMAN BRUCE J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01L23/50 ,  H01L21/52 ,  H05K1/18

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：BR8807783A

公开(公告)日：1990-08-07

申请号：BR8807783

申请日：1988-10-17

Applicant: MOTOROLA INC

Inventor： URBISH GLENN F ,  MCKEE JOHN M ,  MCKINLEY MARTIN J ,  SUPPLESA ANTHONY B

IPC: H04B1/08 ,  H04B7/26 ,  H04Q7/14 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

Abstract: A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

公开(公告)号：AT119723T

公开(公告)日：1995-03-15

申请号：AT89900954

申请日：1988-10-17

Applicant: MOTOROLA INC

Inventor： URBISH GLENN F ,  MCKEE JOHN M ,  MCKINLEY MARTIN J ,  SUPPLESA ANTHONY B

IPC: H04B1/08 ,  H04B7/26 ,  H04Q7/14 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

Abstract: A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

公开(公告)号：CA1316574C

公开(公告)日：1993-04-20

申请号：CA578413

申请日：1988-09-26

Applicant: MOTOROLA INC

Inventor： URBISH GLENN F ,  MCKEE JOHN M ,  MCKINLEY MARTIN J ,  SUPPELSA ANTHONY B

IPC: H04B1/08 ,  H04B7/26 ,  H04Q7/14 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

Abstract: A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strengthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

公开(公告)号：AU9163991A

公开(公告)日：1992-07-22

申请号：AU9163991

申请日：1991-11-21

Applicant: MOTOROLA INC

Inventor： MULLEN WILLIAM B III ,  URBISH GLENN F ,  FREYMAN BRUCE J

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/02 ,  H01R43/00

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

公开(公告)号：IE910675A1

公开(公告)日：1991-09-11

申请号：IE67591

申请日：1991-02-28

Applicant: MOTOROLA INC

Inventor： SUPPELSA ANTHONY B ,  III WILLIAM B MULLEN ,  URBISH GLENN F

IPC: H01L21/60 ,  H05K1/00 ,  H05K1/03 ,  H05K3/40

Abstract: A selectively releasing runner and substrate assembly 10 comprises a plurality of conductive runners 16 adhered to a substrate 12, a portion 18 of at least some of the conductive runners 16 have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to a predetermined stress.