公开(公告)号：JP2003179372A

公开(公告)日：2003-06-27

申请号：JP2002271249

申请日：2002-09-18

Applicant: MOTOROLA INC

Inventor： WONG HENRY ,  BERTRAM THOMAS J

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20 ,  H01L23/40

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for cooling an electronic component in which increase of cost or lowering of efficiency of a cooling system by heat removal is eliminated. SOLUTION: The apparatus comprises a heat removing unit (108) fixed to an electronic module (100) while spaced apart from a component (102) by a specified distance (110), and a heat conductor (112) having a first part (115) coupled with the component (102) and a second part (117) coupled with the heat removing unit (108). The method for removing heat (118) from the component (102) on the surface (104) of the electronic module (100) comprises a step for generating heat (118), a step for conducting heat (118) from the component (102) through the heat conductor (112), and a step for storing heat (118) in the heat removing unit (108) fixed to the electronic module (100). COPYRIGHT: (C)2003,JPO

公开(公告)号：WO2006025947B1

公开(公告)日：2006-05-04

申请号：PCT/US2005024152

申请日：2005-07-08

Applicant: MOTOROLA INC ,  WONG HENRY ,  BLANKENSHIP DALE C ,  KELLY JOHN H ,  LILES DENNIS E ,  NAUFEL NAUFEL C ,  HILL CHARLES C

Inventor： WONG HENRY ,  BLANKENSHIP DALE C ,  KELLY JOHN H ,  LILES DENNIS E ,  NAUFEL NAUFEL C ,  HILL CHARLES C

IPC: H05K7/20

CPC classification number: H05K7/20909 ,  G06F1/20

Abstract: An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Abstract translation: 一种集成电源空气入口单元（124），其被耦合以可滑动地插入到嵌入式计算机机箱（100）的第一间隙区域（120）中，其中第一间隙区域由模块部分（102），后表面 110）和第一侧表面（112）包括被耦合以向所述嵌入式计算机机箱供电的电源（128）以及基本垂直于所述第一侧表面的前表面（130）。 冷却空气团（140）通过前表面沿与前表面基本垂直（150）的方向被吸入嵌入式计算机机箱中，其中当进入集成电源空气入口单元时，冷却空气团基本上转动90度 以基本上平行于前表面的方向流过模块部分，并且其中集成电源空气入口单元在嵌入式计算机机箱中可热插拔。

公开(公告)号：WO2006025946A3

公开(公告)日：2006-06-08

申请号：PCT/US2005024151

申请日：2005-07-08

Applicant: MOTOROLA INC ,  WONG HENRY

Inventor： WONG HENRY

IPC: H05K7/20

CPC classification number: H05K7/20909 ,  G06F1/20

Abstract: A method of cooling a module portion (202) of an embedded computer chassis (200), where the module portion comprises a front module (206) coupled to a front portion of a backplane (204), and a rear module (208) coupled to a rear portion of the backplane, where the front module and the rear module are horizontally disposed, the method includes drawing a cooling air mass (240) into the embedded computer chassis through a front surface (230) of a first interspace region (220) and an upper front surface (231) of a second interspace region (221) in a direction substantially perpendicular (250) to the front surface and the upper front surface. A third interspace region (222) receives a first portion of the cooling air mass (241), the cooling air mass exhausting from the embedded computer chassis through a rear surface (210) in a direction substantially perpendicular (256) to the rear surface.

Abstract translation: 一种冷却嵌入式计算机机箱（200）的模块部分（202）的方法，其中所述模块部分包括耦合到背板（204）的前部的前模块（206）和耦合到背板（204）的前部的后模块 到所述背板的后部，其中所述前模块和所述后模块水平地布置，所述方法包括通过第一空间区域（220）的前表面（230）将冷却空气块（240）拉入所述嵌入式计算机机架 ）和第二空间区域（221）的上前表面（231）在大致垂直于所述前表面和所述上前表面的方向上。 第三间隙区域（222）接收冷却空气质量块（241）的第一部分，冷却空气质量从嵌入式计算机机架通过后表面（210）沿着基本上垂直于（256）的方向排出到后表面。

公开(公告)号：AT345664T

公开(公告)日：2006-12-15

申请号：AT02019564

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：CA2444223A1

公开(公告)日：2004-04-16

申请号：CA2444223

申请日：2003-10-01

Applicant: MOTOROLA INC

Inventor： WONG HENRY ,  GERMAN MARK S ,  STEFFENSEN NILS P

IPC: G06F13/00 ,  G06F13/40 ,  H01R13/642 ,  H05K7/10

Abstract: A VME multi-service platform system (100) includes a payload module (10 6) coupled to operate within a VME multi-service platform system chassis (202) having a VMEbus network (102) and a switched fabric network (104) that operate concurrently and includes the payload module having a first switched fabric connector (210) i n a P0 mechanical envelope (218) and a payload module keying mechanism (222) in the P0 mechanical envelope of the payload module that uniquely corresponds to a fir st switched fabric network standard.

公开(公告)号：DE60216033T2

公开(公告)日：2007-06-21

申请号：DE60216033

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/427

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：CA2399898A1

公开(公告)日：2003-03-21

申请号：CA2399898

申请日：2002-08-27

Applicant: MOTOROLA INC

Inventor： WONG HENRY ,  BERTRAM THOMAS J

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (10 2) and a second portion (117) coupled to heat removal device (108). A method for removing he at (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：DE60216033D1

公开(公告)日：2006-12-28

申请号：DE60216033

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/427

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)