公开(公告)号：JP2003163484A

公开(公告)日：2003-06-06

申请号：JP2002272919

申请日：2002-09-19

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  RICHARDSON PATRICK J ,  WONG SUZANNE M

IPC: G06F1/16 ,  G06F1/18 ,  H05K7/14 ,  H05K9/00

Abstract: PROBLEM TO BE SOLVED: To provide effective EMC design. SOLUTION: A gasket (110) is fixed on a bezel (104) which is electrically connected to a front panel (102). A method for electrically connecting the panel (102) to the bezel (104) provides the front panel (102) having an inner surface (112) for forming an aperture (114). In the method, the bezel (104) is formed so as to have a periphery (118), and the inner surface (112) of the aperture (114) is designed so as to receive the vessel (104). Since the gasket (110) is designed so as to be fixed on the periphery (118) of the vessel (104) and connected to the inner surface (112), the inner surface (112) receives the vessel (104), and the vessel (104) is electrically connected to the front panel (102) through the gasket (110). COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003179372A

公开(公告)日：2003-06-27

申请号：JP2002271249

申请日：2002-09-18

Applicant: MOTOROLA INC

Inventor： WONG HENRY ,  BERTRAM THOMAS J

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20 ,  H01L23/40

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for cooling an electronic component in which increase of cost or lowering of efficiency of a cooling system by heat removal is eliminated. SOLUTION: The apparatus comprises a heat removing unit (108) fixed to an electronic module (100) while spaced apart from a component (102) by a specified distance (110), and a heat conductor (112) having a first part (115) coupled with the component (102) and a second part (117) coupled with the heat removing unit (108). The method for removing heat (118) from the component (102) on the surface (104) of the electronic module (100) comprises a step for generating heat (118), a step for conducting heat (118) from the component (102) through the heat conductor (112), and a step for storing heat (118) in the heat removing unit (108) fixed to the electronic module (100). COPYRIGHT: (C)2003,JPO

公开(公告)号：AT345664T

公开(公告)日：2006-12-15

申请号：AT02019564

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：DE60216033D1

公开(公告)日：2006-12-28

申请号：DE60216033

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/427

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：DE60216033T2

公开(公告)日：2007-06-21

申请号：DE60216033

申请日：2002-09-02

Applicant: MOTOROLA INC

Inventor： BERTRAM THOMAS J ,  WONG HENRY

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/427

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：CA2399898A1

公开(公告)日：2003-03-21

申请号：CA2399898

申请日：2002-08-27

Applicant: MOTOROLA INC

Inventor： WONG HENRY ,  BERTRAM THOMAS J

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (10 2) and a second portion (117) coupled to heat removal device (108). A method for removing he at (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)

公开(公告)号：CA2399814A1

公开(公告)日：2003-03-21

申请号：CA2399814

申请日：2002-08-27

Applicant: MOTOROLA INC

Inventor： RICHARDSON PATRICK J ,  BERTRAM THOMAS J ,  WONG SUZANNE M

IPC: G06F1/16 ,  G06F1/18 ,  H05K7/14 ,  H05K9/00 ,  H05K7/00 ,  H05K5/00

Abstract: An apparatus including a front panel (102) and a bezel (104) coupled to the front panel (102) and having a gasket (110), where the gasket (110) is affixed to the bezel (104) and electrically couples the bezel (104) to the front panel (102). Bezel (10 4) can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel (102) to a bezel (104) includes providin g a front panel (102) having an inner surface (112) defining a cut-out (114). Also, providin g a bezel (104) having a perimeter (118), where the inner surface (112) of the cut-out (114) is designed to receive the bezel (104). Affixing a gasket (110) to the perimeter (118) of bezel (104) an the inner surface (112) receiving the bezel (104) where the gasket (110) is designed to be coupled to the inner surface (112), and electrically coupling the bezel (104 ) to the front panel (102) through the gasket (110).