公开(公告)号：JPH10199839A

公开(公告)日：1998-07-31

申请号：JP36706797

申请日：1997-12-24

Applicant: MOTOROLA INC

Inventor： SAN C KIM ,  RAJIV BAJAJI ,  ZALESKI MARK A

IPC: H01L21/304 ,  B24B37/24 ,  B24D13/12 ,  B24D13/14

Abstract: PROBLEM TO BE SOLVED: To polish two different substances at high cost efficiency by preparing a polisher having a pad with a specified Shore D hardness, placing a semiconductor element substrate on the pad, and polishing a semiconductor substrate to condition the pad. SOLUTION: A semiconductor element substrate 27 is held with a polishing arm, moved onto a polishing platen 22, rotated and pressed to the platen and polished. During polishing of the substrate 27 a conditioning arm 28 presses a conditioning disc 29 against a polishing pad and vibrates from the center of the edge the platen 22 to the edge, thereby removing a layer to be polished. The substrate 27 is finished and moved onto a finish platen 24 and polished. On this platen 24, residual polishing grains are removed, using a high-softness pad. The polishing pad has a Shore D hardness of about less than 45. Thus two different substances are polished at high cost efficiency.