公开(公告)号：WO1994027777A1

公开(公告)日：1994-12-08

申请号：PCT/US1994003730

申请日：1994-04-05

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Abstract translation: 用于形成用于微电子封装的焊料连接（图2中的32）的类型的焊膏（图1中的24）包括组成不同的金属粉末的混合物。 该糊料包括由锡 - 铋焊料合金形成的第一金属粉末。 该糊料还包含含有金或银的第二金属粉末。 在回流期间，金或银合金与锡 - 铋焊料增加熔化部分并增强产品连接的机械性能。

公开(公告)号：EP0655961B1

公开(公告)日：2000-07-12

申请号：EP94932155.8

申请日：1994-04-05

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35/34 ,  B23K35/26 ,  B23K35/02

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

公开(公告)号：EP0655961A1

公开(公告)日：1995-06-07

申请号：EP94932155.0

申请日：1994-04-05

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35 ,  H05K3

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.