公开(公告)号：WO1994023555A1

公开(公告)日：1994-10-13

申请号：PCT/US1994002777

申请日：1994-03-17

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: H05K03/34

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

Abstract translation: 在电子封装中，用于接合引线表面（31,40）的焊料连接（14）由包含第三金属，优选金或银的锡 - 铋合金形成，其量有效地增加合金的熔化温度， 在运行中通常遇到的升高的温度下增强连接的机械性能。 用于形成焊料连接的工艺包括将第三金属的膜（36）施加到至少一个引线表面（31）上，然后将锡 - 铋焊膏（38）施加到膜上。 优选地，将锡 - 铋合金的板（26）首先电镀在其上镀有第三金属的引线表面（31）上。 在加热回流焊料期间，第三金属溶解以产生形成连接的均匀液体。

公开(公告)号：EP0643903B1

公开(公告)日：1997-08-06

申请号：EP94912785.6

申请日：1994-03-17

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: H05K3/34 ,  B23K35/26

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

公开(公告)号：EP0655961A1

公开(公告)日：1995-06-07

申请号：EP94932155.0

申请日：1994-04-05

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35 ,  H05K3

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

公开(公告)号：WO1994027777A1

公开(公告)日：1994-12-08

申请号：PCT/US1994003730

申请日：1994-04-05

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Abstract translation: 用于形成用于微电子封装的焊料连接（图2中的32）的类型的焊膏（图1中的24）包括组成不同的金属粉末的混合物。 该糊料包括由锡 - 铋焊料合金形成的第一金属粉末。 该糊料还包含含有金或银的第二金属粉末。 在回流期间，金或银合金与锡 - 铋焊料增加熔化部分并增强产品连接的机械性能。

公开(公告)号：WO1993006964A1

公开(公告)日：1993-04-15

申请号：PCT/US1992007346

申请日：1992-09-02

Applicant: MOTOROLA, INC.

Inventor： MOTOROLA, INC. ,  MELTON, Cynthia ,  RALEIGH, Carl ,  CHOLEWCZYNSKI, Kenneth ,  MOORE, Kevin

IPC: B23K31/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/17 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14505 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for attaching an integrated circuit component to a printed circuit board by a plurality of solder bump interconnections utilizes a printed circuit board comprising a solder-plated circuit trace. The trace includes terminals, each including a terminal pad and a runner section. A solder plate formed of a first solder alloy is applied to the terminal to extend continuously between the pad and the runner section. Solder bumps are affixed to the component and are formed of second compositionally distinct solder alloy having a melting temperature greater than the first alloy. The component and board are then assembled so that the bumps rest against the solder-plated terminal pads, and heated to a temperature effective to melt the solder plate but not the bump alloy. Upon cooling to resolidify the solder, the solder plate is fused to the bumps to form the interconnections.

公开(公告)号：EP0655961B1

公开(公告)日：2000-07-12

申请号：EP94932155.8

申请日：1994-04-05

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  BECKENBAUGH, William ,  MILLER, Dennis

IPC: B23K35/34 ,  B23K35/26 ,  B23K35/02

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

公开(公告)号：EP0643903A1

公开(公告)日：1995-03-22

申请号：EP94912785.0

申请日：1994-03-17

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: B23K35 ,  H05K3

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

公开(公告)号：EP0559863A1

公开(公告)日：1993-09-15

申请号：EP92919654.0

申请日：1992-09-02

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  RALEIGH, Carl ,  CHOLEWCZYNSKI, Kenneth ,  MOORE, Kevin

IPC: B23K1 ,  H01L21 ,  H05K1 ,  H05K3

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2201/40 ,  H01L24/17 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14505 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/49144

Abstract: Un procédé permettant de fixer un composant (10) de circuit intégré à une plaquette de circuits imprimés (12) par l'intermédiaire d'une multiplicité d'interconnexions par bosses de contact (40), consiste à utiliser une plaquette de circuits imprimés comprenant un ruban de circuit métallisé. Le ruban comporte des plages de connexion (20), dont chacune est pourvue d'une pastille (22) et d'une piste conductrice (24). Une couche métallisée (28) composée d'un premier alliage de soudure est appliquée sur la plage de connexion de façon à s'étendre sans interruption entre la pastille et la piste conductrice. Des bosses de contact (30, 32), composées d'un second alliage de soudure, de composition différente, et dont la température de fusion est supérieure à celle du premier alliage, sont fixées au composant. Celui-ci et la plaquette sont ensuite assemblés de façon que la bosse (30) prend appui sur les pastilles métallisées, et chauffés jusqu'à une température permettant de fondre la couche métallisée mais non l'alliage de la bosse. Lorsque la soudure se solidifie à nouveau en refroidissant, la couche métallisée se fusionne aux bosses pour produire les interconnexions.

Abstract translation: 一种用于通过多个接触凸点互连（40）将集成电路元件（10）连接到印刷电路板（12）的方法，包括使用印刷电路板，该印刷电路板包括 一个金属化电路板。 该带具有连接垫（20），每个连接垫设置有垫（22）和导电轨道（24）。 由第一焊料合金构成的金属化层（28）被施加在连接焊盘上以便在焊盘和导电迹线之间连续地延伸。 将由不同组成的第二焊料合金构成并且其熔化温度高于第一合金熔化温度的接触凸点（30,32）固定到该部件上。 然后组装该晶片和晶片，使得凸台（30）支撑在金属化粒料上，并加热到一定温度以熔化金属化层而不是凸块的合金。 当焊料再次冷却固化时，金属化层与凸块熔合以产生互连。