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    IMPLANTABLE MEDICAL DEVICES
    1.
    发明申请
    IMPLANTABLE MEDICAL DEVICES 审中-公开
    可植入医疗器械

    公开(公告)号：WO2016106269A1

    公开(公告)日：2016-06-30

    申请号：PCT/US2015/067257

    申请日：2015-12-22

    Applicant: MEDTRONIC, INC.

    Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: A61N1/375

    CPC classification number: A61N1/3754 ,  H05K3/32 ,  H05K3/42

    Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Abstract translation: 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。

    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME
    2.
    发明申请
    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME 审中-公开
    有意义的组装及其形成方法

    公开(公告)号：WO2016106274A1

    公开(公告)日：2016-06-30

    申请号：PCT/US2015/067262

    申请日：2015-12-22

    Applicant: MEDTRONIC, INC.

    Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: A61N1/375

    CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

    Abstract translation: 公开了馈通组件的各种实施例以及形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点。 外部接触件可以电耦合到布置在通孔中的导电材料。 并且外部接触可以通过围绕通孔的键气密密封到非导电衬底的外表面。 在一个或多个实施方案中，该键可以是激光键。

    EMBEDDED METALLIC STRUCTURES IN GLASS
    3.
    发明申请
    EMBEDDED METALLIC STRUCTURES IN GLASS 审中-公开
    玻璃中的嵌入金属结构

    公开(公告)号：WO2017091432A1

    公开(公告)日：2017-06-01

    申请号：PCT/US2016/062445

    申请日：2016-11-17

    Applicant: MEDTRONIC, INC.

    Inventor： DAY, John K. ,  RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: H01L23/15 ,  H01L23/498

    CPC classification number: H05K1/0306 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K3/10 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/09036

    Abstract: A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.

    Abstract translation: 提供了一种在玻璃中嵌入金属结构的器件。 该器件包括第一晶片，至少一个导电迹线，平坦化的绝缘层和第二晶片。 第一晶片具有至少一个填充有导电材料的第一晶片通孔。 该至少一个导电迹线形成在第一晶片上。 所述至少一个导电迹线经由填充有导电材料的至少一个第一晶片与所述至少一个第一晶片接触。 平坦化的绝缘层形成在第一晶片和至少一个导电迹线上。 平坦化的绝缘层还具有至少一个绝缘层通孔，其提供通向至少一个导电迹线的一部分的路径。 第二个晶圆粘接到平面化的绝缘层上。

    HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER
    4.
    发明申请
    HERMETIC CONDUCTIVE FEEDTHROUGHS FOR A SEMICONDUCTOR WAFER 审中-公开
    用于半导体滤波器的传导传导函数

    公开(公告)号：WO2015054485A1

    公开(公告)日：2015-04-16

    申请号：PCT/US2014/059886

    申请日：2014-10-09

    Applicant: MEDTRONIC, INC.

    Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: A61N1/375 ,  A61N1/05 ,  H01L23/057 ,  H05K5/00

    CPC classification number: C03B23/20 ,  A61N1/3754 ,  A61N1/3756 ,  B81B2207/095 ,  B81C1/00301 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H05K5/0095 ,  H01L2924/00

    Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

    Abstract translation: 玻璃晶片具有由晶片厚度分离的内表面和相对的外表面。 密封的导电馈通通过晶片从内表面延伸到相对的外表面。 馈通包括具有沿着内表面暴露的内表面的馈通构件，用于电耦合到电路。 馈通构件从内表面部分地延伸通过晶片厚度到密封地嵌入晶片内的面向外部的外表面。

    IMPLANTABLE MEDICAL DEVICES
    6.
    发明公开
    IMPLANTABLE MEDICAL DEVICES 审中-公开
    可植入医疗设备

    公开(公告)号：EP3237060A1

    公开(公告)日：2017-11-01

    申请号：EP15823893.1

    申请日：2015-12-22

    Applicant: Medtronic, Inc.

    Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: A61N1/375

    CPC classification number: H05K5/066 ,  A61N1/3754 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  H05K2203/107

    Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Abstract translation: 公开了可植入医疗设备系统的各种实施例以及形成这种系统的方法。 在一个或多个实施例中，可植入医疗设备系统包括壳体，布置在壳体内的电子器件以及附连到壳体的侧壁并电耦合到电子器件的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料以及设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部触点电连接到布置在通孔中的导电材料。 在一个或多个实施例中，外部触点通过围绕通孔的激光键合而密封到非导电衬底的外表面。

    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME
    9.
    发明公开
    FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME 审中-公开
    馈送组件及其形成方法

    公开(公告)号：EP3237061A1

    公开(公告)日：2017-11-01

    申请号：EP15830927.8

    申请日：2015-12-22

    Applicant: Medtronic, Inc.

    Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

    IPC: A61N1/375

    CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

    Abstract translation: 公开了馈通组件的各种实施例和形成这种组件的方法。 在一个或多个实施例中，馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料，以及设置在非导电衬底的外表面上的通孔上方的外部触点。 外部触点可以电连接到布置在通孔中的导电材料。 并且外部接触件可以通过包围通孔的接合部密封到非导电基板的外表面。 在一个或多个实施例中，该键可以是激光键。

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