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    Variable capacitor tuned using laser micromachining
    1.
    发明授权
    Variable capacitor tuned using laser micromachining 有权

    公开(公告)号：US09099248B2

    公开(公告)日：2015-08-04

    申请号：US12216006

    申请日：2008-06-27

    Applicant: Michael A. Huff ,  Mehmet Ozgur

    Inventor： Michael A. Huff ,  Mehmet Ozgur

    IPC: H01G7/00 ,  H01G5/14 ,  H01L49/02

    CPC classification number: H01G5/145 ,  H01L28/60

    Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.

    Method of making an integrated electromechanical switch and tunable capacitor
    2.
    发明授权
    Method of making an integrated electromechanical switch and tunable capacitor 有权
    制造集成的机电开关和可调电容器的方法

    公开(公告)号：US06969630B2

    公开(公告)日：2005-11-29

    申请号：US10663983

    申请日：2003-09-17

    Applicant: Mehmet Ozgur

    Inventor： Mehmet Ozgur

    IPC: B81B3/00 ,  B81B7/02 ,  H01H1/00 ,  H01H61/00 ,  H01L21/00

    CPC classification number: H01H1/0036 ,  B81B2201/014 ,  B81B2201/031 ,  B81C1/00246 ,  B81C2203/0735 ,  H01H61/00 ,  H01H2061/006

    Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

    Abstract translation: 描述了能够处理从DC到毫米波频率的信号的单片集成的机电微波开关，以及集成的机电可调电容器。 两个机电装置都包括通过热机械或静电力而致动的可移动梁。 这些器件直接在成品硅基集成电路晶片上制造，例如CMOS，BiCMOS或双极晶片。 可移动光束通过选择性地去除在基于硅的集成电路技术中可获得的薄膜下面的支撑硅而形成，该技术包括至少一个多晶硅层和两个金属化层。 使用空腔和厚的低损耗金属化在可动梁的上方形成电极。 在空腔所在的区域上形成厚的机械支撑层，或者衬底被体微加工，即蚀刻。

    Closed cell metal composites
    4.
    发明授权
    Closed cell metal composites 失效
    闭孔金属复合材料

    公开(公告)号：US06709739B1

    公开(公告)日：2004-03-23

    申请号：US09980493

    申请日：2002-06-24

    Applicant: Robert L. Mullen ,  Mehmet Ozgur ,  Gerhard E. Welsch

    Inventor： Robert L. Mullen ,  Mehmet Ozgur ,  Gerhard E. Welsch

    IPC: B32B704

    CPC classification number: A61L31/022 ,  A61L27/04 ,  A61L27/56 ,  A61L31/146 ,  B22F1/025 ,  B22F3/1103 ,  B22F3/1112 ,  B22F2003/1106 ,  C22C32/00 ,  C22C32/0089 ,  F16D65/12 ,  F16D69/027 ,  F16D2065/1328 ,  F16D2069/002 ,  F16D2200/0004 ,  Y10T428/1234 ,  Y10T428/249974 ,  Y10T428/249982 ,  Y10T428/249997 ,  Y10T428/2991

    Abstract: A plurality of closed metal cells is provided. Each cell encapulates a fluid or a fluid-like filler with a metal skin or cell wall. The closed cells are joined into an aggregate arrangement to form a composite material in which the bonded cell walls form a continuous metal matrix. The cell walls and the encapulated cell filler fluid or fluid-like filler provide controllable stiffness and strength as well as vibration-damping and shock-absorbing characteristics to the material. The resulting closed cell metal composite finds many advantages uses including use as a prosthetic device, a casting, or an automotive component. The component material is elastically compliant or stiff, depending on the design, as well as lightweight and resistant to buckling and crushing. The material provides desirable physical properties such as heat-capacity, thermal and electrical conductivity, vibration-damping capacity, and shock-absorbing characteristics.

    Abstract translation: 提供多个封闭的金属电池。 每个细胞包裹着一种具有金属皮肤或细胞壁的流体或流体状填料。 闭孔结合成聚集体排列以形成复合材料，其中粘合的细胞壁形成连续的金属基质。 细胞壁和包封的细胞填充液或流体状填料为材料提供可控的刚度和强度以及减震和减震特性。 所得到的闭孔金属复合材料发现许多优点，包括用作假体装置，铸件或汽车部件。 根据设计，组件材料是弹性柔性的或刚性的，以及重量轻并且抗屈曲和破碎。 该材料提供了所需的物理性质，例如热容，导热和导电性，减震能力和减震特性。

    Variable capacitor tuned using laser micromachining
    6.
    发明授权
    Variable capacitor tuned using laser micromachining 有权

    公开(公告)号：US09019686B2

    公开(公告)日：2015-04-28

    申请号：US13611619

    申请日：2012-09-12

    Applicant: Michael A. Huff ,  Mehmet Ozgur

    Inventor： Michael A. Huff ,  Mehmet Ozgur

    IPC: H01G5/00 ,  H01G5/14 ,  H01L49/02

    CPC classification number: H01G5/145 ,  H01L28/60

    Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.

    Micro-mechanical capacitive inductive sensor for detection of relative or absolute pressure
    8.
    发明授权
    Micro-mechanical capacitive inductive sensor for detection of relative or absolute pressure 有权
    用于检测相对或绝对压力的微机电容感应传感器

    公开(公告)号：US07188530B2

    公开(公告)日：2007-03-13

    申请号：US11009706

    申请日：2004-12-13

    Applicant: Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

    Inventor： Michael Pedersen ,  Mehmet Ozgur ,  Michael A. Huff

    IPC: G01L9/12

    CPC classification number: G01L9/0073

    Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.

    Abstract translation: 公开了一种微机械压力传感器，其中电容式换能器结构与电感线圈集成以形成LC谐振电路，其谐振频率可以通过在换能器上施加电磁场而远程检测。 电容式换能器结构包括导电可移动隔膜，固定相对电极和所述隔膜与电极之间的预定气隙。 隔膜响应于施加的压力差而偏转，导致结构中的电容变化，并因此导致LC谐振电路的谐振频率偏移。 可以通过测量和确定换能器的电磁阻抗中相应的峰值来远程检测LC电路的谐振频率。

    Integrated electromechanical switch and tunable capacitor and method of making the same
    10.
    发明授权
    Integrated electromechanical switch and tunable capacitor and method of making the same 有权
    集成机电开关和可调谐电容器及其制造方法

    公开(公告)号：US06800912B2

    公开(公告)日：2004-10-05

    申请号：US10147300

    申请日：2002-05-17

    Applicant: Mehmet Ozgur

    Inventor： Mehmet Ozgur

    IPC: H01L2984

    CPC classification number: H01H1/0036 ,  B81B2201/014 ,  B81B2201/031 ,  B81C1/00246 ,  B81C2203/0735 ,  H01H61/00 ,  H01H2061/006

    Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.

    Abstract translation: 描述了能够处理从DC到毫米波频率的信号的单片集成的机电微波开关，以及集成的机电可调电容器。 两个机电装置都包括通过热机械或静电力而致动的可移动梁。 这些器件直接在成品硅基集成电路晶片上制造，例如CMOS，BiCMOS或双极晶片。 可移动光束通过选择性地去除在基于硅的集成电路技术中可获得的薄膜下面的支撑硅而形成，该技术包括至少一个多晶硅层和两个金属化层。 使用空腔和厚的低损耗金属化在可动梁的上方形成电极。 在空腔所在的区域上形成厚的机械支撑层，或者衬底被体微加工，即蚀刻。

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