公开(公告)号：EP1085219A3

公开(公告)日：2003-07-09

申请号：EP00810798.9

申请日：2000-09-05

Applicant: Memscap S.A.

Inventor： Dhuler, Vijayakumar R. ,  Hill, Edward ,  Cowen, Allen

IPC: F15C5/00 ,  H01H37/32

CPC classification number: F16K99/0001 ,  B81B3/0024 ,  B81B2201/031 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0036 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H1/0036 ,  H01H37/32 ,  H01H2037/008 ,  Y10S310/06

Abstract: The MEMS thermal actuator (10) includes a microelectronic substrate (14) having a first surface (26) and at least one anchor structure (18,20) affixed to the first surface (26). A composite beam (12) extends from the anchor(s) (18,20) and overlies the first surface (26) of the substrate (14). The composite beam (12) is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface (26) of the microelectronic substrate (14). In one embodiment the composite beam (12) comprises two or more layers (28,30) having materials that have correspondingly different thermal coefficients of expansion. An electrically conductive path may extend throughout the composite beam (12) to effectuate thermal actuation. In one embodiment of the invention a two layer composite beam comprises a first layer (28) of a semiconductor material and a second layer (30) of a metallic material. The semiconductor material may be selectively doped during fabrication so as to create a self-contained heating mechanism within the composite beam. The invention also comprises a MEMS thermal actuator that includes two or more composite beams disposed in an array.

公开(公告)号：EP1081391A3

公开(公告)日：2003-07-02

申请号：EP00810770.8

申请日：2000-08-29

Applicant: Memscap S.A.

Inventor： Dhuler, Vijayakumar R. ,  Walters, Mark David

IPC: F15C5/00

CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

Abstract: A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (50) and a thermally actuated microactuator (20). For example, the MEMS device (10) may be a valve. As such, the valve may include at least one valve plate (30) that is controllably brought into engagement with at least one valve opening (40) in the microelectronic substrate (50) by selective actuation of the microactuator (20). While the MEMS device (10) can include various microactuators (20), the microactuator advantageously includes a pair of spaced apart supports (22) disposed on the substrate (50) and at least one arched beam (24) extending therebetween. The microactuator (20) may further include metallization traces (70) on distal portions (23) of the arched beams (24) to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch (680) for maintaining the valve plate (30) in a desired position without requiring continuous energy input to the microactuator (20).