公开(公告)号：US4908939A

公开(公告)日：1990-03-20

申请号：US141074

申请日：1988-01-05

Applicant: Leonard Shieber ,  J. Philip Plonski ,  Michael Vignola ,  Benjamin G. Chin

Inventor： Leonard Shieber ,  J. Philip Plonski ,  Michael Vignola ,  Benjamin G. Chin

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K7/06

CPC classification number: H05K7/06 ,  H05K1/0219 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/429 ,  Y10T29/49162

Abstract: In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.

Abstract translation: 在制造根据本发明的同轴互连板的情况下，将同轴导体刻划在电路板基板上。 使用粘合剂将同轴导体预成型并以预定图案固定在基底上。 形成接地平面的导电层覆盖连接同轴导体的屏蔽的衬底的表面。 除了同轴信号导体之外的导电材料在同轴导体的终端点周围消除，从而形成间隙区域。 间隙区域允许信号导体连接到表面端子焊盘，而不会与屏蔽导体或接地平面短路。

公开(公告)号：US4770788A

公开(公告)日：1988-09-13

申请号：US727117

申请日：1985-04-25

Applicant: Michael Vignola

Inventor： Michael Vignola

IPC: C02F1/42 ,  B01J41/04 ,  C23C18/16

CPC classification number: B01J41/043 ,  C23C18/1617

Abstract: This invention relates to a process for treating waste solutions and rinse waters, especially those from electroless plating processes to remove organometallic complexes and complexing agents, particularly copper and copper-EDTA complexes by eluting the waste solutions through anionic exchange resins.

Abstract translation: 本发明涉及一种用于处理废溶液和冲洗水的方法，特别是那些通过无电镀方法除去有机金属络合物和络合剂，特别是铜和铜 - EDTA络合物的水，通过阴离子交换树脂洗脱废溶液。

公开(公告)号：US4743710A

公开(公告)日：1988-05-10

申请号：US788834

申请日：1985-10-18

Applicant: Leonard Shieber ,  J. Philip Plonski ,  Michael Vignola ,  Benjamin G. Chin

Inventor： Leonard Shieber ,  J. Philip Plonski ,  Michael Vignola ,  Benjamin G. Chin

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K7/06 ,  H05K1/00

CPC classification number: H05K1/0219 ,  H05K7/06 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  H05K3/429

Abstract: In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.

Abstract translation: 在制造根据本发明的同轴互连板的情况下，将同轴导体刻划在电路板基板上。 使用粘合剂将同轴导体预成型并以预定图案固定在基底上。 形成接地平面的导电层覆盖连接同轴导体的屏蔽的衬底的表面。 除了同轴信号导体之外的导电材料在同轴导体的终端点周围消除，从而形成间隙区域。 间隙区域允许信号导体连接到表面端子焊盘，而不会与屏蔽导体或接地平面短路。