公开(公告)号：EP0310357B1

公开(公告)日：1994-07-13

申请号：EP88308996.3

申请日：1988-09-28

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, David H.

IPC: H05K1/00

CPC classification number: H01L23/5383 ,  H01L23/4985 ,  H01L23/5382 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0289 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP0310357A3

公开(公告)日：1991-01-09

申请号：EP88308996.3

申请日：1988-09-28

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, David H.

IPC: H05K1/00

CPC classification number: H01L23/5383 ,  H01L23/4985 ,  H01L23/5382 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0289 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A customizable circuit using a programmable interconnect and a compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form along diagonal lines having a pitch determined by the basic wire segment length. The terminal ends of each of these segments are positioned in a plane such that the segments may be connected by short lengths to form the desired interconnect. The links which join the line segments represent the customization of the otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed are methods for forming the interconnect and the TAB chip bonding design.

Abstract translation: 使用可编程互连和兼容TAB芯片接合设计的可定制电路。 可编程互连包括形成可编程结而不是连续导线的线段层。 该分割是利用每一层中的线对线的偏移来执行的，使得每个层中的段的端部沿着具有由基本线段长度确定的间距的对角线形成。 这些片段中的每一个的末端位于平面中，使得片段可以通过短长度连接以形成所需的互连。 连接线段的链接代表了否定的未互连互连的定制。 TAB芯片接合设计使用载带将集成电路芯片连接到可编程互连。 还公开了用于形成互连和TAB芯片接合设计的方法。

公开(公告)号：EP0310357A2

公开(公告)日：1989-04-05

申请号：EP88308996.3

申请日：1988-09-28

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, David H.

IPC: H05K1/00

CPC classification number: H01L23/5383 ,  H01L23/4985 ,  H01L23/5382 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0289 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A customizable circuit using a programmable interconnect and a compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed with an offset from line to line in each layer such that the ends of the segments in each layer form along diagonal lines having a pitch determined by the basic wire segment length. The terminal ends of each of these segments are positioned in a plane such that the segments may be connected by short lengths to form the desired interconnect. The links which join the line segments represent the customization of the otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed are methods for forming the interconnect and the TAB chip bonding design.

Abstract translation: 使用可编程互连和兼容TAB芯片接合设计的可定制电路。 可编程互连包括形成可编程结而不是连续导线的线段层。 该分割是利用每一层中的线对线的偏移来执行的，使得每个层中的段的端部沿着具有由基本线段长度确定的间距的对角线形成。 这些片段中的每一个的末端位于平面中，使得片段可以通过短长度连接以形成所需的互连。 连接线段的链接代表了否定的未互连互连的定制。 TAB芯片接合设计使用载带将集成电路芯片连接到可编程互连。 还公开了用于形成互连和TAB芯片接合设计的方法。