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    METHOD AND APPARATUS FOR ALIGNING MATING FORM TOOLS
    3.
    发明公开
    METHOD AND APPARATUS FOR ALIGNING MATING FORM TOOLS 失效
    用于对准工具的方法和装置

    公开(公告)号：EP0493411A4

    公开(公告)日：1992-08-12

    申请号：EP90913152

    申请日：1990-08-30

    Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

    Inventor： WEHRLY, JAMES, DOUGLASS, JR. ,  BERTRAM, MICHAEL, JOHN

    IPC: B21D28/00 ,  B21D28/04 ,  B21D28/34 ,  B26F1/14 ,  H01L21/00 ,  H01L21/60 ,  H01L23/50 ,  B21D37/12

    CPC classification number: H01L21/67144 ,  B26F1/14 ,  B26F2210/08 ,  Y10T83/8855

    Abstract: An object of the invention is to provide simple and convenient alignment between two mating form tools. The technical problem is the time consuming trial and error procedures frequently used to align mating tools with fine tolerances, for instance 0.025 mils. The invention solves the alignment problem by using a plurality of alignment members (22) extending upward from a surface (26) of one mating tool (14) so that the alignment members (22) engage in slidable contact with alignment tracks (32) formed in the edges of the other mating tool (14). In certain embodiments the alignment members (22) and tracks (32) can be formed in the four corners of rectangular mating tools, and the alignment members (22) can be cylindrical rods with dome shaped tops (30). The alignment is useful for tooling set-up as well as tooling usage. The principle use of the invention is for alignment between a punch (12) and lead form anvil (14) as they are brought together to form TAB tape outer leads (56) connected to an integrated circuit (54).

    ENHANCED NONDESTRUCTIVE HOLOGRAPHIC RECONSTRUCTION
    4.
    发明公开
    ENHANCED NONDESTRUCTIVE HOLOGRAPHIC RECONSTRUCTION 失效
    增强非结构性全息重构

    公开(公告)号：EP0407396A4

    公开(公告)日：1992-06-03

    申请号：EP89902214

    申请日：1988-12-29

    Applicant: MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION

    Inventor： REDFIELD, STEPHEN, R. ,  HESSELINK, LAMBERTUS

    IPC: B41M5/26 ,  G03H1/02 ,  G03H1/04

    CPC classification number: G03H1/0248 ,  Y10S359/90

    Abstract: A method for promoting enhanced nondestructive reconstruction of holograms recorded in photorefractive media (10) involves control of the polarization states of the reconstruction beam (24) and the recording beams (24, 26), control of the cumulative recording energy, and use of a relatively high external field applied across the media (10) during recording which is subsequently reduced during reconstruction. The resulting reconstruction history characteristics are selectively tailored by adjusting the polarization and intensity of the reconstruction beam (24), the recording geometry, and the applied voltage (40) during reconstruction and recording, and various other parameters. In general, the reconstruction efficiency (48) starts at a relatively high level, initially reduces, and then subsequently grows above the starting values, and can be made substantially nondestructive over a typical reconstruction cycle, with erasure times exceeding forty-five minutes.

    Heat exchanger having piezoelectric fan means
    5.
    发明公开
    Heat exchanger having piezoelectric fan means 失效
    电动汽车。

    公开(公告)号：EP0385090A1

    公开(公告)日：1990-09-05

    申请号：EP90101229.4

    申请日：1990-01-22

    Applicant: Microelectronics and Computer Technology Corporation

    Inventor： Nelson, Richard Douglas

    IPC: H01L23/473 ,  H01L23/467

    CPC classification number: F04D33/00 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A fluid heat exchanger (10) for cooling an electronic component (16) including a housing (12) having a fluid inlet (18) and fluid outlet (20). Piezoelectric means (32, 34) are connected to a plurality of flexible blades (30) for pumping fluid from the inlet (18) to the outlet (20). A heat conductive structure is connected to the housing base (12) for conducting heat to the fluid. The heat conductive structure may include the flexible blades (30) and/or fixed metal fins (40).

    Abstract translation: 一种用于冷却包括具有流体入口（18）和流体出口（20）的壳体（12）的电子部件（16）的流体热交换器（10）。 压电装置（32,34）连接到多个柔性叶片（30），用于将流体从入口（18）泵送到出口（20）。 导热结构连接到壳体基座（12），用于将热传导到流体。 导热结构可以包括柔性叶片（30）和/或固定金属翅片（40）。

    Heat exchanger and method of making same
    6.
    发明公开
    Heat exchanger and method of making same 失效
    热交换器及其制造方法

    公开(公告)号：EP0267772A3

    公开(公告)日：1989-02-22

    申请号：EP87309904.8

    申请日：1987-11-09

    Applicant: Microelectronics and Computer Technology Corporation

    Inventor： Herrell, Dennis, J. ,  Gupta, Omkarnath Ramnath ,  Hilbert, Claude

    IPC: H01L23/467 ,  H01L23/367

    CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: A heat exchanger for cooling or heating an object, which heat exchanger (10) comprises a plurality of spaced apart substantially parallel thermally conductive fins (18, 20) characterized in that diverting means (26, 26 b , 26 e , 26 f , 58) are provided which, when a gas is introduced in one direction into said heat exchanger (10) diverts at least part of said gas in a second direction generally perpendicular to said one direction. In one embodiment, the heat exchanger (10) comprises two interdigitated sets of oppositely facing cooling fins (18, 20) which are of generally right-angled triangular configuration. Cooling air is introduced downwardly into the heat exchanger (10) from duct (16) and is diverted horizontally by the hypotenuse of the cooling fins (18, 20). The cooling air leaves the heat exchanger (19) in mutually opposite directions through the passageways (30) formed between adjacent fins in each set of fins. The heat exchanger (10) is particularly useful as a heat sink for use with electronic chips (12). Several other embodiments are described.

    METHODS FOR FABRICATING FLAT PANEL DISPLAY SYSTEMS AND COMPONENTS
    8.
    发明公开
    METHODS FOR FABRICATING FLAT PANEL DISPLAY SYSTEMS AND COMPONENTS 失效
    用于生产平板显示系统和组件

    公开(公告)号：EP0727057A1

    公开(公告)日：1996-08-21

    申请号：EP95901056.0

    申请日：1994-10-26

    Applicant: Microelectronics and Computer Technology Corporation

    Inventor： KUMAR, Nalin ,  XIE, Chenggang

    IPC: H01J9 ,  H01J17 ,  H01J19 ,  H01J29 ,  H01J31 ,  H04N1

    CPC classification number: H01J9/025 ,  H01J31/127 ,  H01J2201/30457

    Abstract: A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line. The figure is an enlarged exploded cross-sectional view of a diode display unit (10) which includes two primary components: cathode plate (12) and anode plate (14). A vacuum is maintained between the plates by a seal (16). Regularly spaced pillars (26) separate cathode plate (12) and anode plate (14). A plurality of low effective work-function emitter areas (24) are formed by respective layers of amorphic diamond along conductive lines (20) disposed on substrate (18). A layer (34) of photo-emitting material is formed along transparent conductive lines (30) which are disposed upon substrate (28). Enlarge pads or leads (32) allow connection to an external signal source.

    Method of making a hermetically sealed package having an electronic component
    10.
    发明公开
    Method of making a hermetically sealed package having an electronic component 失效
    一种用于制造含有电子元件的气密密封外壳平方法。

    公开(公告)号：EP0407649A1

    公开(公告)日：1991-01-16

    申请号：EP89112993.4

    申请日：1989-07-14

    Applicant: Microelectronics and Computer Technology Corporation

    Inventor： Andrews, Daniel Marshall

    IPC: H05K5/06 ,  H01L21/60 ,  H01L21/00 ,  H01L21/56

    CPC classification number: H01L21/50 ,  Y10T29/49121 ,  Y10T29/49169

    Abstract: Forming a body (10) of insulating material with a shelf (14) and an opening (12) therethrough with a plurality of electrical conductors (16) extending from the shelf (14) to the exterior of the body. A plurality of tape automated bonding leads (26) are placed in the opening (12) in which the inner ends of the leads are connected together. The outer ends (28) of the leads are aligned with the electrical conductors (16) and bonded thereto and the inner ends (30) of the leads are disconnected from each other. An electronic component (50) is bonded to a bottom cover (52), aligned in the opening (12), and the inner ends (30) of the leads are bonded to the electrical component (50). The bottom (52) and a top cover (60) are sealably connected to the body (10) enclosing the opening and the electronic component.

    Abstract translation: 形成具有搁板（14）和上开口（12）通过与电导体（16）从所述搁板（14）到所述主体的外部延伸的多个绝缘材料存在的主体（10）。 带自动键合引线（26）的多个被置于其中的引线的内端连接在一起的开口（12）。 引线的外端（28）与所述电导体（16）和与其结合和内端的引线（30）从断开海誓山盟对齐。 一种电子部件（50）被键合到下盖（52），在开口（12）和引线的内端（30）对齐的键合到电元件（50）。 底部（52）和顶盖（60）以可密封地连接到所述本体（10）包围所述开口和所述电子元件。

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