公开(公告)号：EP0329133A3

公开(公告)日：1990-07-11

申请号：EP89102675.9

申请日：1989-02-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, Davis Harrison

IPC: H01L23/52

CPC classification number: H01L23/5384 ,  H01L23/5383 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/112

Abstract: A substrate (30) for attaching electrical devices (42) having an interconnect wiring structure (34) and a support (32) for the interconnect, the support having a number of vias (38), or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

公开(公告)号：EP0329133A2

公开(公告)日：1989-08-23

申请号：EP89102675.9

申请日：1989-02-16

Applicant: Microelectronics and Computer Technology Corporation

Inventor： Carey, Davis Harrison

IPC: H01L23/52

CPC classification number: H01L23/5384 ,  H01L23/5383 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/112

Abstract: A substrate (30) for attaching electrical devices (42) having an interconnect wiring structure (34) and a support (32) for the interconnect, the support having a number of vias (38), or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

Abstract translation: 一种用于附接具有互连布线结构（34）的电气设备（42）和用于互连的支撑件（32）的基板（30），所述支撑件具有多个通孔（38）或贯穿孔，并且电连接到 互连。 衬底允许电气器件在与通孔处的互连件相对的一侧上而不是在互连本身上附接。 通过这样做，芯片可以更密集地堆积，因为不需要通常保留用于工程变换焊盘，测试焊盘等的芯片之间的区域，这些功能在基板的相对侧上的互连上执行。