公开(公告)号：US20030129415A1

公开(公告)日：2003-07-10

申请号：US10331591

申请日：2002-12-30

Applicant: Micron Technology, Inc.

Inventor： Robert Rasmussen ,  Jianping P. Yang

IPC: B32B017/06

CPC classification number: H01J29/22 ,  C09K11/02 ,  C09K11/08 ,  H01J31/123

Abstract: A method is provided for binding phosphor particles in a field emission device. The method includes applying phosphor particles to a substrate, submerging the substrate into a binder solution, and removing the substrate from the binder solution at a predetermined rate.

公开(公告)号：US20030124247A1

公开(公告)日：2003-07-03

申请号：US10331716

申请日：2002-12-30

Applicant: Micron Technology, Inc.

Inventor： Robert Rasmussen ,  Jianping P. Yang

IPC: D06L003/12 ,  B05B005/00 ,  B05D003/02 ,  B05D001/18 ,  B32B009/00

CPC classification number: H01J29/22 ,  C09K11/02 ,  C09K11/08 ,  H01J31/123

Abstract: A method is provided for binding phosphor particles in a field emission device. The method includes applying phosphor particles to a substrate, submerging the substrate into a binder solution, and removing the substrate from the binder solution at a predetermined rate.

Abstract translation: 提供了一种用于结合场致发射器件中的荧光体颗粒的方法。 该方法包括将荧光体颗粒施加到基底，将基底浸入粘合剂溶液中，并以预定的速率从粘合剂溶液中除去基底。