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公开(公告)号：US20230291086A1
公开(公告)日：2023-09-14
申请号：US18198473
申请日：2023-05-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Noriaki OKUDA , Kosuke NISHIO , Masanori OKAMOTO , Kentarou KAWABE
Abstract: In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.
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公开(公告)号：US20240074038A1
公开(公告)日：2024-02-29
申请号：US18360831
申请日：2023-07-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kentarou KAWABE
IPC: H05K1/02
CPC classification number: H05K1/0251 , H01P3/081
Abstract: A maximum width of a second connection portion in a line width direction is smaller than a maximum width of a first connection portion in the line width direction. A first intermediate portion includes a first thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. A second intermediate portion includes a second thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. The first thick-line portion and the second thick-line portion adjoin the transmission line portion.
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公开(公告)号：US20230043114A1
公开(公告)日：2023-02-09
申请号：US17974581
申请日：2022-10-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kentarou KAWABE
Abstract: A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.
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Patent Agency Ranking
公开(公告)号：US20230318160A1
公开(公告)日：2023-10-05
申请号：US18207169
申请日：2023-06-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yushi SOETA , Kentarou KAWABE , Kouki SHIMIZU , Toru KURISU , Akihiro YAMAKAWA
CPC classification number: H01P3/088 , H01P3/082 , H05K1/09 , H05K1/05 , H05K3/4644
Abstract: A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.
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公开(公告)号：US20230299453A1
公开(公告)日：2023-09-21
申请号：US18201212
申请日：2023-05-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Kentarou KAWABE
CPC classification number: H01P3/088 , H01P3/082 , H05K1/028 , H05K1/144 , H05K2201/095
Abstract: A multilayer substrate includes layers stacked on each other in an up-down direction of a multilayer body. The layers include a first spacer, a first ground conductive layer above the first spacer, and a signal conductive layer that overlaps the first ground conductive layer and is located below the first spacer. First through-holes pass through the first spacer and are arranged along a first direction. A distance between centroids of first through-holes adjacent to each other in the first direction is uniform or substantially uniform. Sets of first through-holes are provided in the first spacer. Sets of first through-holes are arranged along a second direction. A distance between centroids of first through-holes adjacent to each other in the second direction is uniform or substantially uniform. At least one first through-hole is a first hollow through-hole overlapping the signal conductive layer.
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公开(公告)号：US20250038413A1
公开(公告)日：2025-01-30
申请号：US18918370
申请日：2024-10-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kentarou KAWABE
IPC: H01Q9/04
Abstract: A second radiating conductor layer is provided to a multilayer body to be in contact with a second insulator layer, is positioned in a positive direction of a Z-axis relative to a first radiating conductor layer, and overlaps the first radiating conductor layer assuming it is viewed in the Z-axis direction. A frequency of an electromagnetic wave radiated or received by the second radiating conductor layer is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer, or an area of the second radiating conductor layer is smaller than an area of the first radiating conductor layer. A first planar ground conductor layer is positioned in a negative direction of the Z-axis relative to the first radiating conductor layer, and overlaps the first radiating conductor layer and the second radiating conductor layer assuming it is viewed in the Z-axis direction.
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公开(公告)号：US20250010577A1
公开(公告)日：2025-01-09
申请号：US18888325
申请日：2024-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Keiichi ICHIKAWA , Kentarou KAWABE
Abstract: In a multilayer substrate, a second multilayer body is positioned in a positive direction of a Z-axis of a first multilayer body. The second multilayer body is fixed to the first multilayer body via a first insulator layer bonded to a second insulator layer. Regions obtained by dividing the first multilayer body into three equal portions in the Z-axis direction are defined as a positive region, an intermediate region, and a negative region. A portion of one or more positive region first conductor layers is located in the positive region. An entirety of one or more intermediate region first conductor layers is located in the intermediate region. A thickness in the Z-axis direction of at least one of the one or more positive region first conductor layers is larger than the thickness in the Z-axis direction of the one or more intermediate region first conductor layers.
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公开(公告)号：US20240088565A1
公开(公告)日：2024-03-14
申请号：US18463302
申请日：2023-09-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kentarou KAWABE
CPC classification number: H01Q9/0407 , H01Q1/38
Abstract: A multilayer board includes a multilayer body including a first radiation conductor layer, a ground conductor layer, a first wiring layer, and a second wiring layer. The first wiring layer is electrically connected to a first radiation conductor layer at a first power supply point positioned closest to a first straight line in a first outer edge and intersects but is not orthogonal to the first straight line in a view along a Z-axis direction. The second wiring layer is electrically connected to the first radiation conductor layer at a second power supply point positioned closest to a second straight line in the first outer edge and intersects but is not orthogonal to the second straight line in a view along the Z-axis direction.
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