CHIP-SHAPED ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20180068792A1

    公开(公告)日:2018-03-08

    申请号:US15480511

    申请日:2017-04-06

    CPC classification number: H01G4/248 H01B1/02 H01G4/12 H01G4/232 H01G4/30

    Abstract: An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20210057162A1

    公开(公告)日:2021-02-25

    申请号:US16930351

    申请日:2020-07-16

    Abstract: A multilayer ceramic electronic component includes a stacked body, and an external electrode including an underlying electrode layer containing a conductive metal and a glass component, a resin layer containing a thermosetting resin and no metal component, and a plating layer. The underlying electrode layer extends from a first or second end surface, and covers a portion of each of first and second main surfaces and first and second lateral surfaces. The resin layer covers the underlying electrode layer on the second main surface adjacent to the first or second end surface. The plating layer covers a portion of the surface of the underlying electrode layer that is not covered with the resin layer, and covers the surface of the resin layer.

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