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    CHIP-SHAPED ELECTRONIC COMPONENT
    2.
    发明申请
    CHIP-SHAPED ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180068792A1

    公开(公告)日：2018-03-08

    申请号：US15480511

    申请日：2017-04-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazunori EGASHIRA ,  Kazunori KUNIMOTO ,  Seiji KATSUTA ,  Yosuke TERASHITA ,  Takayoshi YAMAMOTO

    IPC: H01G4/248 ,  H01G4/30 ,  H01B1/02

    CPC classification number: H01G4/248 ,  H01B1/02 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

    Abstract: An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.

    MULTILAYER CERAMIC CAPACITOR
    4.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20180174753A1

    公开(公告)日：2018-06-21

    申请号：US15846369

    申请日：2017-12-19

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yosuke TERASHITA ,  Hidetaka SUGIYAMA

    IPC: H01G4/248 ,  H01G4/30 ,  H01G13/00 ,  H01G4/008

    Abstract: A multilayer ceramic capacitor includes a laminate and first and second external electrodes that each include first and second underlying electrode layers, first and second conductive resin layers, and first and second plating layers. The first underlying electrode layer includes a portion not covered with the first conductive resin layer on an end surface of the laminate, and the first plating layer is disposed on a surface of the portion of the first underlying electrode layer. The second underlying electrode layer includes a portion not covered with the second conductive resin layer on an end surface of the laminate, and the second plating layer is disposed on a surface of the portion of the second underlying electrode layer.

    MULTILAYER CERAMIC CAPACITOR AND MOUNTED STRUCTURE THEREOF
    5.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MOUNTED STRUCTURE THEREOF 审中-公开

    公开(公告)号：US20190304683A1

    公开(公告)日：2019-10-03

    申请号：US16367304

    申请日：2019-03-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yosuke TERASHITA

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/012 ,  H01G4/228

    Abstract: A multilayer ceramic capacitor includes a laminated body, and an external electrode on both end surfaces of the laminated body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The amount of a curvature radius along a boundary portion between the base electrode layer and the conductive resin layer the boundary between the base electrode layer and the conductive resin layer at the ridge line of the laminated body is about 296.6 μm or more, the long side length in terms of flattened powder value is about 10.3 μm or more, the solid content concentration of PVC in the conductive resin layer is about 45 vol % or higher and about 60 vol % or lower, and the thickness of the conductive resin layer located at the ridge line is about 11.7 μm or more.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    7.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210057161A1

    公开(公告)日：2021-02-25

    申请号：US16897320

    申请日：2020-06-10

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kota ZENZAI ,  Yosuke TERASHITA

    IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12

    Abstract: A multilayer ceramic electronic component includes a ceramic body and outer electrodes on two end surfaces of the ceramic body. Each of the outer electrodes includes a base electrode layer that is on the ceramic body and includes a sintered metal and glass, and a conductive resin layer that is on the base electrode layer and includes a metal filler and a resin. When a maximum thickness of the conductive resin layers that respectively lie on end surfaces of the ceramic body is denoted as T1 and when a maximum thickness of conductive resin layers adjacent to a first main surface and second main surface of the ceramic body or a first side surface or a second side surface of the ceramic body is denoted as T2, T1/T2 is about 2.4 or more.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    8.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210057155A1

    公开(公告)日：2021-02-25

    申请号：US16897322

    申请日：2020-06-10

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kota ZENZAI ,  Yosuke TERASHITA ,  Atsushi NAKAMOTO

    IPC: H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H01G4/30 ,  H01B1/22

    Abstract: A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 μm or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

    MULTILAYER CERAMIC CAPACITOR
    9.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20190148074A1

    公开(公告)日：2019-05-16

    申请号：US16177537

    申请日：2018-11-01

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yosuke TERASHITA

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, inner electrodes and outer electrodes that are connected to the inner electrodes and disposed on a first end surface and a second end surface of the multilayer body. The outer electrodes each include a resin electrode layer containing a thermosetting resin and a metal component and a plating layer in contact with the resin electrode layer. The metal component of the resin electrode layer contains Ni. The plating layer is a Sn plating layer.

    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
    10.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20160233028A1

    公开(公告)日：2016-08-11

    申请号：US15133432

    申请日：2016-04-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yosuke TERASHITA

    IPC: H01G4/248 ,  H01L41/29 ,  H01F41/02 ,  H01G4/252 ,  H01C17/28

    Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

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