公开(公告)号：US20230203237A1

公开(公告)日：2023-06-29

申请号：US17913334

申请日：2021-03-30

Applicant: NAMICS CORPORATION

Inventor： Yuya NAKAI ,  Rieko NAGATA

IPC: C08G59/18 ,  C08G59/50 ,  C08G59/68

CPC classification number: C08G59/184 ,  C08G59/5073 ,  C08G59/686 ,  C08G2170/00 ,  C08G2190/00

Abstract: An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.

公开(公告)号：US20230097646A1

公开(公告)日：2023-03-30

申请号：US17802784

申请日：2020-04-24

Applicant: NAMICS CORPORATION

Inventor： Yuya NAKAI ,  Takashi YAMAGUCHI

IPC: C08G59/40 ,  C08L63/00 ,  C09J163/00

Abstract: An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R2 and R3 are each independently a group selected from hydrogen and C1-C6 alkyls.)