公开(公告)号：US20230143754A1

公开(公告)日：2023-05-11

申请号：US17912204

申请日：2021-03-15

Applicant: NAMICS CORPORATION

Inventor： Ayako SATO ,  Rieko NAGATA

IPC: C08F122/14

CPC classification number: C08F122/14

Abstract: An object of the present invention is to provide a photocurable resin composition which is quickly cured through anionic polymerization even by irradiation with ultraviolet light from a ultraviolet light-emitting diode in the UV-A or UV-B range, the resin composition suitable for the manufacture of electronic components.
The photocurable resin composition of the present invention comprises (a) a 2-methylene-1,3-dicarbonyl compound, (b) an ionic photo base generator and (c) a photo-sensitizer. The 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one specific structural unit, and the ionic photo base generator is a salt comprising specific anion (i) and cation (ii).

公开(公告)号：US20230203237A1

公开(公告)日：2023-06-29

申请号：US17913334

申请日：2021-03-30

Applicant: NAMICS CORPORATION

Inventor： Yuya NAKAI ,  Rieko NAGATA

IPC: C08G59/18 ,  C08G59/50 ,  C08G59/68

CPC classification number: C08G59/184 ,  C08G59/5073 ,  C08G59/686 ,  C08G2170/00 ,  C08G2190/00

Abstract: An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.