公开(公告)号：JP2008147482A

公开(公告)日：2008-06-26

申请号：JP2006334175

申请日：2006-12-12

Applicant: Nec Corp ,  日本電気株式会社

Inventor： ISHIDA TOMOTAKA ,  YAMAMOTO MITSURU ,  HOJO SAKAE

IPC: H01L23/427 ,  F25D9/00 ,  F28D15/02 ,  H05K7/20

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a device for cooling a boiled gas medium which effectively cools an object-to-be-cooled, keeping the object-to-be-cooled for a long life and an electronic apparatus for mounting its device. SOLUTION: The device 10 for cooling a boiled gas medium includes: a cooling container 14 in which a liquid cooling medium 12 is enclosed; a heat absorbing portion 18 which is a part of the wall surface of the cooling container, absorbs the heat produced by the object 16-to-be-cooled located on the outside of the cooling container, and transmits the heat to the liquid cooling medium 12 through the wall surface; a radiation portion 24 which is a part of inside of the cooling container and absorbs the heat to cool a boiled gas cooling medium 20 and liquefy it; a liquid cooling medium vibration means 26 which is located on the outside of the cooling container and vibrates the liquid cooling medium 12 at a predetermined vibration frequency; and a characteristic vibration frequency reducing means 28 which is located between the object-to-be-cooled 16 and liquid cooling medium vibration means 26 and reduces a characteristic vibration frequency of the object-to-be-cooled locating portion A on which the object-to-be-cooled 16 is located lower than the vibration frequency. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种用于冷却沸腾气体介质的装置，其有效地冷却待冷却的物体，保持被冷却物体的寿命长，以及用于安装其的电子装置 设备。 解决方案：用于冷却沸腾气体介质的装置10包括：冷却容器14，其中封入有液体冷却介质12; 作为冷却容器的壁面的一部分的吸热部18吸收由位于冷却容器的外侧的待冷却物体16产生的热量，并将热量传递给液体冷却介质 12通过墙面; 辐射部24，其是冷却容器的内部的一部分，并吸收热量以冷却沸腾的气体冷却介质20并使其液化; 液体冷却介质振动装置26，其位于冷却容器的外侧，并使液体冷却介质12以预定的振动频率振动; 以及位于被冷却对象物16与液体冷却介质振动装置26之间的特征振动频率降低装置28，并且降低被冷却物体A的特征振动频率， 被冷却的16位于低于振动频率。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007187026A

公开(公告)日：2007-07-26

申请号：JP2006004119

申请日：2006-01-11

Applicant: Nec Corp ,  日本電気株式会社

Inventor： YAMAMOTO MITSURU ,  ISHIDA TOMOTAKA ,  HOJO SAKAE ,  MURATA KAZUHITO ,  KINOSHITA MASAO

IPC: F04B43/04

Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric type liquid conveyer which is reliable, can be miniaturized and thinned, and has large flow rate characteristics while having a structure to prevent a piezoelectric vibration element from being exposed to high humidity.
SOLUTION: Water contact resin sheet 10 composed of resin sheet having metal foil 11 stuck on one surface is fixed on a water contact part which is a pump chamber 9 side of a bimorph type piezoelectric vibration element 12 with the resin sheet facing to water contact side, the water contact sheet 10 covers the pump chamber 9 including a side wall upper end part of a pump casing part 1, and is put between the pump casing body 1 and a pump lid part 15. A humidity resistant sheet rubber 13 of low moisture permeability is put between the pump lid part 15 and the water contact resin sheet 10. An outer circumference of an electrode of the piezoelectric vibration element is constructed inside of an outer circumference of the pump chamber 9 which is a support of vibration.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供可靠的小型化和薄型化的压电式液体输送机，并且具有大的流量特性，同时具有防止压电振动元件暴露于高湿度的结构。 解决方案：将具有粘附在一个表面上的金属箔11的树脂片构成的水接触树脂片10固定在作为双压电晶片型压电振动元件12的泵室9侧的水接触部分上，树脂片面向 水接触片10覆盖包括泵壳部1的侧壁上端部的泵室9，并且被放置在泵壳体1和泵盖部15之间。防湿片橡胶13 在泵盖部15与水接触树脂片10之间放置低透湿性的压电振动元件的电极的外周构成作为振动支撑体的泵室9的外周侧。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006322386A

公开(公告)日：2006-11-30

申请号：JP2005146513

申请日：2005-05-19

Applicant: NEC CORP ,  NEC ACCESS TECHNICA LTD

Inventor： ISHIDA TOMOTAKA ,  YAMAMOTO MITSURU ,  HOJO SAKAE ,  KATSUMATA AKIRA

IPC: F01P11/00

Abstract: PROBLEM TO BE SOLVED: To provide a method and a device for simply injecting cooling liquid with the ratio of cooling liquid and gas strictly controlled in a cooling device having a channel of which inner volume is unknown and having solid structure of which volume does not change. SOLUTION: The channel 1 filled with cooling liquid, a decompression pump 2 attached on one end of the channel, and a cooling liquid supply tank 3 attached on another end of the channel are provided. Cooling liquid is injected in the channel 1 from the cooling liquid supply tank 3 by atmospheric pressure after an inside of the channel is decompressed to a fixed pressure by the decompression pump 2. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2006242176A

公开(公告)日：2006-09-14

申请号：JP2006014251

申请日：2006-01-23

Applicant: Nec Corp ,  日本電気株式会社

Inventor： YAMAMOTO MITSURU ,  MIKUBO KAZUYUKI ,  HOJO SAKAE ,  SASAKI YASUHIRO ,  OCHI ATSUSHI

IPC: F04B43/04 ,  F04B9/00 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L2224/16225

Abstract: PROBLEM TO BE SOLVED: To intend to enhance flexibility of mounting a cooling device in an electronic apparatus such as a laptop personal computer or the like, by enhancing flexibility of designing it and thinning its total thickness to 10 mm or less, or 5 mm or less. SOLUTION: In this cooling device equipped with a liquid cooling means to diffuse heat from a heat generating component in the electronic apparatus by a coolant, and an air cooling means which is laminated on the liquid cooling means, and in which a group of air cooling fins to radiate heat diffused by the liquid cooling means are formed, this piezoelectric pump is to circulate the coolant, and is assembled in the liquid cooling means with a flat piezoelectric element used as a driving source, and is integrally connected with the liquid cooling means by using a metal material. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提高将冷却装置安装在诸如膝上型个人计算机等的电子设备中的灵活性，通过增强其设计的灵活性并将其总厚度变薄到10mm以下，或者 5毫米或更小。 解决方案：在具有液体冷却装置的冷却装置中，通过冷却剂从电子设备中的发热部件扩散热量，以及层压在液体冷却装置上的空气冷却装置，其中组 形成用于散发由液体冷却装置扩散的热量的空气冷却翅片，该压电泵使冷却剂循环，并且以用作驱动源的扁平压电元件组装在液体冷却装置中，并且与 液体冷却装置通过使用金属材料。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004079721A

公开(公告)日：2004-03-11

申请号：JP2002236762

申请日：2002-08-15

Applicant: Nec Corp ,  日本電気株式会社

Inventor： SOKAWA SADAMICHI ,  YAMAZAKI TAKAO ,  HAJIYAMA ICHIRO ,  HOJO SAKAE

IPC: H01L23/12 ,  H01L21/60

CPC classification number: H01L2224/73204

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device in which stress in a conductive connection part is relieved and thermal stress in a low elastic modulus insulating layer is relieved. SOLUTION: In the semiconductor device, a semiconductor chip 1 and electrode pads 2 and 6 of a circuit board 5 are connected by the conductive connection part 4, and the low elastic modulus insulating layer 8 is arranged between the semiconductor chip 1 and the circuit board 5. The conductive connection part 4 is composed of an elastic material that can be restored against outer force and it is formed of a plurality of bending parts or curve parts. A physical characteristic of the low elasticity insulating layer 8 differs in a semiconductor chip 1-side and a circuit board 5-side. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002299365A

公开(公告)日：2002-10-11

申请号：JP2001102899

申请日：2001-04-02

Applicant: NEC CORP ,  JAPAN EM KK

Inventor： HAJIYAMA ICHIRO ,  HOJO SAKAE ,  SHIMADA YUZO ,  KATAHIRA AKIO ,  ISHIDA ATSUSHI ,  TERAJIMA MASARU ,  FUTAGAMI KAZUHIKO

IPC: B25J15/06 ,  H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a fine spherical body suction transfer device which is suitable for sucking a number of fine spherical bodies in batch with high operability and accurately transferring them to a semiconductor element or an electrode pad of a wiring substrate. SOLUTION: The spherical body suction transfer device has a pit 18, corresponding to a semiconductor element or an electrode pad of a wiring substrate, sucks a spherical body 20 to the pit 18, carries the spherical body 20 on an electrode pad, and thereafter transfers a spherical body on an electrode pad removing the spherical body 20. It consists of a suction part 23 with the pit 18, and an evacuation hole 4 and a support part 22 with a through-hole 21, corresponding to the evacuation hole 4, and the suction part 23 is formed of silicon.

公开(公告)号：JP2002151550A

公开(公告)日：2002-05-24

申请号：JP2000348272

申请日：2000-11-15

Applicant: NEC CORP

Inventor： FUNAYA TAKAHISA ,  SENBA NAOHARU ,  TAKAHASHI NOBUAKI ,  HOJO SAKAE ,  SHIMADA YUZO

IPC: H05K1/14 ,  H01L21/60 ,  H01L23/12 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device having a flip-chip structure of high connection reliability in which occurrence of incomplete connection due to difference of thermal expansion between a functional element device and a circuit device can be prevented, a connection body of a circuit board and a functional element device rejected in electrical inspection after temporary connection can be reconnected easily after separated temporarily, and low thermal resistance can be ensured even when a large power consuming function element device having simple structure and a low package cost is used, to provide its manufacturing method, and a coil spring cutting jig and a coil spring feed jig for use therein. SOLUTION: A metal layer 3 is provided on the surface layer of the surface circuit board electrode 5 of a circuit board 6, a metal layer 3 is provided on the surface layer of the chip electrode 2 of a function element chip 1, a vertical coil spring 4 is connected with the surface circuit board electrode 5 and the chip electrode 2 through respective metal layers 3, and the surface circuit board electrode 5 is flip-chip connected with the chip electrode 2 through the vertical coil spring 4.

公开(公告)号：JP2001004858A

公开(公告)日：2001-01-12

申请号：JP17109699

申请日：1999-06-17

Applicant: NEC CORP

Inventor： ODA MIKIO ,  HOJO SAKAE ,  SHIMADA YUZO

IPC: G02B6/13 ,  C08F299/02 ,  C08G59/18 ,  G02B6/12

Abstract: PROBLEM TO BE SOLVED: To provide an optical waveguide having high heat resistance, in particular, and excellent cost efficiency and being manufacturable with a relatively simple and easy manufacturing process. SOLUTION: This optical waveguide is formed on a substrate 1, and has a core 3 and clads (a lower clad 2 and an upper clad 4) having smaller refractive indexes than the core 3. The core 3 or both the core 3 and the clads (the lower clad 2 and the upper clad 4 are formed with an epoxy acrylate resin having a fluorene skeleton.

公开(公告)号：JP2000286380A

公开(公告)日：2000-10-13

申请号：JP8895799

申请日：1999-03-30

Applicant: NEC CORP

Inventor： HASHIMOTO KATSUMASA ,  HOJO SAKAE ,  SENBA NAOHARU ,  EBIHARA NOBUAKI ,  OKAWA SEIICHIRO

IPC: H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To improve connection with and enhance the strength of, a stack module by connecting a stack assembly to a mother board through solder bumps and filling the spaces between single-carrier layers and between the stack assembly and the mother board with resin. SOLUTION: A stack module 1 is formed by mounting a stack assembly 2 on a mother board 8 by soldering using so-called ball solder (solder bumps) or the like. Sealing resin 7 is placed and filled in between the stack assembly 2 and the mother board 8 and between the carrier substrates 4 of single carrier comprising the stack assembly 2 and the filled sealing resin 7 disperses stress exerted on the ball solder. As a result, the electrical and mechanical reliability of the joints of the solder, such as the ball solder, is enhanced against repetitive thermal stress and the packaging structure of the semiconductor renders it sufficiently resistant to vibration and impact.

公开(公告)号：JP2000014026A

公开(公告)日：2000-01-14

申请号：JP18032898

申请日：1998-06-26

Applicant: NEC CORP

Inventor： HOJO SAKAE ,  MIKUBO KAZUYUKI

IPC: H01L23/38 ,  H01L35/28 ,  H01M10/46 ,  H02J7/00

Abstract: PROBLEM TO BE SOLVED: To provide an electronic device, which is light in weight and small in size, capable of efficiently cooling a semiconductor package in the electronic device and also capable of extending even a life of a secondary battery. SOLUTION: One or a plurality of secondary batteries 3, a semiconductor chip 4 driven by the secondary battery 3, a package 2 mounting the semiconductor chip 4, a printed board 8 mounting the package 2, and a thermoelectric converter device 7 converting thermal energy generated by the semiconductor chip 4 into electric energy between the package 2 and the printed board 8, are provided inside the body of equipment 1. Here, the secondary battery is charged with the electric energy converted in the thermoelectric converter device 7.