公开(公告)号：GB2435545B

公开(公告)日：2010-08-11

申请号：GB0703637

申请日：2007-02-23

Applicant: NEC CORP ,  NAT INST OF ADVANCED IND SCIEN

Inventor： TSUCHIYA TETSUO ,  MIZUTA SUSUMU ,  KUMAGAI TOSHIYA ,  SASAKI TOKUHITO ,  KURASHINA SEIJI

IPC: G01J5/20

公开(公告)号：CA2945597C

公开(公告)日：2019-01-15

申请号：CA2945597

申请日：2015-04-15

Applicant: NEC CORP

Inventor： KURASHINA SEIJI ,  MIYOSHI MASARU

IPC: G01J1/02

Abstract: A terahertz-wave detector having a thermal separation structure in which a temperature detection unit 14 including a bolometer thin film 7 connected to electrode wiring 9 is supported so as to be lifted above a substrate 2 by a support part 13 including the electrode wiring 9 connected to a reading circuit 2a formed on the substrate 2, wherein the terahertz-wave detector is provided with a reflective film 3 that is formed on the substrate 2 and reflects terahertz waves and an absorption film 11 that is formed on the temperature detection unit 14 and absorbs terahertz waves and the reflective film 3 is integrally formed with the reflective film of an adjacent terahertz-wave detector.

公开(公告)号：CA2945597A1

公开(公告)日：2015-10-22

申请号：CA2945597

申请日：2015-04-15

Applicant: NEC CORP

Inventor： KURASHINA SEIJI ,  MIYOSHI MASARU

IPC: G01J1/02

Abstract: A terahertz-wave detector having a thermal separation structure in which a temperature detection unit (14) including a bolometer thin film (7) connected to electrode wiring (9) is supported so as to be lifted above a substrate (2) by a support part (13) including electrode wiring (9) connected to a reading circuit (2a) formed on the substrate (2), wherein the terahertz-wave detector is provided with a reflective film (3) that is formed on the substrate (2) and reflects terahertz waves and an absorption film (11) that is formed on the temperature detection unit (14) and absorbs terahertz waves and the reflective film (3) is integrally formed with the reflective film of an adjacent terahertz-wave detector.

公开(公告)号：GB2435545A

公开(公告)日：2007-08-29

申请号：GB0703637

申请日：2007-02-23

Applicant: NEC CORP ,  NAT INST OF ADVANCED IND SCIEN

Inventor： TSUCHIYA TETSUO ,  MIZUTA SUSUMU ,  KUMAGI TOSHIYA ,  SASAKI TOKUHITO ,  KURASHINA SEIJI

IPC: G01J5/20

Abstract: A vanadium oxide thin film is deposited onto a thermally isolated bridge structure by a dry film forming method (eg CVD, sputtering) to form a resistive heat sensor. The vanadium oxide film is irradiated with laser light which increases the temperature coefficient of resistance (TCR) of the vanadium oxide thermally sensitive film.

公开(公告)号：EP3133379A4

公开(公告)日：2017-11-22

申请号：EP15780439

申请日：2015-04-15

Applicant: NEC CORP

Inventor： KURASHINA SEIJI ,  MIYOSHI MASARU

IPC: G01J1/02 ,  G01J5/08 ,  G01J5/20

CPC classification number: G01J5/10 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/0803 ,  G01J5/0809 ,  G01J5/20 ,  G01J2005/103

Abstract: A terahertz-wave detector having a thermal separation structure in which a temperature detection unit 14 including a bolometer thin film 7 connected to electrode wiring 9 is supported so as to be lifted above a substrate 2 by a support part 13 including the electrode wiring 9 connected to a reading circuit 2a formed on the substrate 2, wherein the terahertz-wave detector is provided with a reflective film 3 that is formed on the substrate 2 and reflects terahertz waves and an absorption film 11 that is formed on the temperature detection unit 14 and absorbs terahertz waves and the reflective film 3 is integrally formed with the reflective film of an adjacent terahertz-wave detector.

公开(公告)号：EP2400540A4

公开(公告)日：2013-10-09

申请号：EP10743499

申请日：2010-01-27

Applicant: NEC CORP

Inventor： YAMAZAKI TAKAO ,  SANO MASAHIKO ,  KURASHINA SEIJI

IPC: H01L23/02 ,  G01J1/02 ,  G01J5/02 ,  G01J5/04 ,  H01L23/057 ,  H01L23/10 ,  H01L23/26

CPC classification number: H05K5/066 ,  G01J5/029 ,  G01J5/045 ,  H01L23/057 ,  H01L23/10 ,  H01L23/26 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state of the hollow portion being evacuated via a through-hole that brings the inside and the outside of the hollow portion into communication, the package main body portion is sealed with a sealing member, the getter material and the electronic device are connected to a first conductor pad and a second conductor pad, the first conductor pad is connected with a third conductor pad via a thermally conductive material, and the second conductor pad is electrically connected with a fourth conductor pad on a wiring substrate.