Abstract:
There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.
Abstract:
PROBLEM TO BE SOLVED: To provide a metal frame which is brazed on a metalized layer provided on a surface of a ceramic package having a cavity opening therein and to which a metal lid is welded thereon, which makes the metalized layer less likely to be peeled during the welding, and to provide a ceramic package using the metal frame.SOLUTION: A metal frame 1a is brazed on a metalized layer 28 which is formed on a surface 22 of a ceramic package body 21 having a cavity 25 opening on the surface 22 so as to enclose a cavity opening that is formed into a rectangular shape in a plane view. The metal frame 1a for a ceramic package includes: a frame body 2 having a rectangular frame shape in the plane view; and a single frame groove 11 formed in an outer peripheral side region 10 on a surface 3 of the frame body 2, which excludes an inner peripheral side region 9 covered by a peripheral part of a metal lid 34, and having a rectangular frame shape in the plane view that is arranged along an outer shape of the frame body 2 in the plane view.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multiple patterning wiring board, for not easily causing failures of breakage, cracking or the like by division grooves formed in a lattice shape in a product region.SOLUTION: The multiple patterning wiring board includes: a product region 4 composed of ceramic, where a plurality of wiring board parts 1 provided with a front surface 2 and a back surface 3 that are rectangular in the plan view are provided together adjacently in a matrix; an ear part 5 similarly composed of ceramic, positioned around the product region 4, and provided with the front surface 2 and the back surface 3 that are in a rectangular frame shape in the plan view; and the division grooves formed in the lattice shape in the plan view on the front surface 2 along a boundary of the adjacent wiring board parts 1 and 1 and a boundary of the product region 4 and the ear part 5. The method of manufacturing the multiple patterning wiring board includes the steps of: arranging a shield plate 10 for shielding a laser beam L on the front surface 2 of the ear part 5 in a green sheet laminate gs; and forming the division grooves in the product region 4 by performing scanning while irradiating the product region 4 of the green sheet laminate gs and the shield plate 10 with the laser beam L.
Abstract:
PROBLEM TO BE SOLVED: To provide an antenna switching module which reduces the required electric power by reducing the loss due to antenna, and can improve the isolation of signals of a plurality of communications systems. SOLUTION: The antenna switching module is provided with an antenna switching module, in which at least a part of a switching circuit for switching a signal route between a transmitting circuit and a receiving circuit, respectively corresponding to different communication systems and antennas is formed in a multilayer base, comprising insulating layers and conducting layers laminated alternately. The antenna switching module has antenna terminals included in terminals, provided to a terminal surface of the multilayer base and is connected to the antennas whose pass bandwidths differ from each other, and the switching circuits connected to the respective antenna terminal. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a high frequency switch module with a high shield effect of a transmission line and capable of decreasing transmission loss. SOLUTION: A high frequency signal processing circuit 2 is configured as a layered body 80 wherein a plurality of conductor layers including circuit conductor elements 111, 45, VA, 101 and 102 and a plurality of dielectric layers 50 are layered. The plurality of conductor layers include: the transmission line 111 and a ground planar conductor 101 as the circuit conductor elements; and an electrically neutral isolated conductor layer 130 isolated from the circuit conductor elements in terms of a DC. Then the transmission line 111 forms an isolated conductor layer accompanying a microstrip line which is sandwiched between a ground planar conductor 102 and the isolated conductor layer 130 in the thickness direction of the layered body 80. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an antenna switch module for a multiband which interrupts harmonic noise generated from a power amplifier and also interrupts harmonic noise generated when a transmitted signal passes through a diode constituting a high frequency switch. SOLUTION: This antenna switch module for a multiband comprises: a branching filter circuit connected to a filter circuit composed of a first inductance element; a first high frequency switch for switching a transmitting circuit and a receiving circuit for the lowest frequency band among a plurality of frequency bands divided by the branching filter circuit; and a second high frequency switch for switching a transmitting circuit and a receiving circuit for a plurality of different frequency bands other than the lowest frequency band. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an antenna switch module for a multiband which corresponds at lease four or more different frequency bands and has little transmission loss without having the possibility that noise such as interference and signal leakage occurs in a multilayer substrate. SOLUTION: This antenna switch module for a multiband comprises a first high frequency switch which is connected to a branching filter circuit and switches a transmitting circuit and a receiving circuit for two different frequency bands, a second high frequency switch for switching a transmitting circuit and a receiving circuit for two different frequency bands other than the two different frequency bands switched by the first high frequency switch, and first and second filter circuits connected between an antenna terminal and the first and second high frequency switches. COPYRIGHT: (C)2004,JPO