MULTI-CAVITY WIRING BOARD AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:EP2627159A4

    公开(公告)日:2018-01-17

    申请号:EP11830572

    申请日:2011-09-30

    Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

    Metal frame for ceramic package and ceramic package
    5.
    发明专利
    Metal frame for ceramic package and ceramic package 审中-公开
    用于陶瓷包装和陶瓷包装的金属框架

    公开(公告)号:JP2013243232A

    公开(公告)日:2013-12-05

    申请号:JP2012115199

    申请日:2012-05-21

    Abstract: PROBLEM TO BE SOLVED: To provide a metal frame which is brazed on a metalized layer provided on a surface of a ceramic package having a cavity opening therein and to which a metal lid is welded thereon, which makes the metalized layer less likely to be peeled during the welding, and to provide a ceramic package using the metal frame.SOLUTION: A metal frame 1a is brazed on a metalized layer 28 which is formed on a surface 22 of a ceramic package body 21 having a cavity 25 opening on the surface 22 so as to enclose a cavity opening that is formed into a rectangular shape in a plane view. The metal frame 1a for a ceramic package includes: a frame body 2 having a rectangular frame shape in the plane view; and a single frame groove 11 formed in an outer peripheral side region 10 on a surface 3 of the frame body 2, which excludes an inner peripheral side region 9 covered by a peripheral part of a metal lid 34, and having a rectangular frame shape in the plane view that is arranged along an outer shape of the frame body 2 in the plane view.

    Abstract translation: 要解决的问题:提供一种金属框架,该金属框架钎焊在设置在其上具有空腔开口的陶瓷封装的表面上的金属化层上,并且金属盖被焊接在其上,这使得金属化层不太可能被剥离 并且提供使用金属框架的陶瓷封装。解决方案:金属框架1a钎焊在金属化层28上,金属化层28形成在陶瓷封装体21的表面22上,陶瓷封装体21具有在表面22上开口的空腔25 以在平面图中包围形成为矩形形状的空腔开口。 用于陶瓷包装的金属框架1a包括:在平面图中具有矩形框架形状的框架体2; 以及形成在框体2的表面3上的外周侧区域10中的单个框架槽11,其不包括被金属盖34的周边部分覆盖的内周侧区域9,并且具有矩形框架形状 在俯视图中沿着框体2的外形配置的平面图。

    Method of manufacturing multiple patterning wiring board
    6.
    发明专利
    Method of manufacturing multiple patterning wiring board 有权
    制造多路连接线路板的方法

    公开(公告)号:JP2012243883A

    公开(公告)日:2012-12-10

    申请号:JP2011110943

    申请日:2011-05-18

    Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multiple patterning wiring board, for not easily causing failures of breakage, cracking or the like by division grooves formed in a lattice shape in a product region.SOLUTION: The multiple patterning wiring board includes: a product region 4 composed of ceramic, where a plurality of wiring board parts 1 provided with a front surface 2 and a back surface 3 that are rectangular in the plan view are provided together adjacently in a matrix; an ear part 5 similarly composed of ceramic, positioned around the product region 4, and provided with the front surface 2 and the back surface 3 that are in a rectangular frame shape in the plan view; and the division grooves formed in the lattice shape in the plan view on the front surface 2 along a boundary of the adjacent wiring board parts 1 and 1 and a boundary of the product region 4 and the ear part 5. The method of manufacturing the multiple patterning wiring board includes the steps of: arranging a shield plate 10 for shielding a laser beam L on the front surface 2 of the ear part 5 in a green sheet laminate gs; and forming the division grooves in the product region 4 by performing scanning while irradiating the product region 4 of the green sheet laminate gs and the shield plate 10 with the laser beam L.

    Abstract translation: 要解决的问题:提供一种制造多个图案化配线板的方法,用于不容易地由于在产品区域中形成为格子状的分隔槽而导致断裂,破裂等的故障。 多层配线基板包括:由陶瓷构成的产品区域4,其中在平面图中设置有矩形的前表面2和后表面3的多个布线板部件1相邻地设置 在矩阵中 类似地由陶瓷构成的耳部5,其位于产品区域4周围,并且在平面图中设置有呈矩形框架形状的前表面2和后表面3; 以及沿着相邻的布线板部件1和1的边界在前表面2上的平面图中形成为格子状的划分槽以及产品区域4和耳朵部分5的边界。 图案布线板包括以下步骤:在生片层叠体gs中配置用于屏蔽耳部5的前表面2上的激光束L的屏蔽板10; 并且通过在用激光束L照射生片层压体gs的产品区域4和屏蔽板10的同时进行扫描,在产品区域4中形成分割槽。(C)2013,JPO&INPIT

    Antenna switching module
    7.
    发明专利
    Antenna switching module 审中-公开
    天线切换模块

    公开(公告)号:JP2008118486A

    公开(公告)日:2008-05-22

    申请号:JP2006301064

    申请日:2006-11-07

    Abstract: PROBLEM TO BE SOLVED: To provide an antenna switching module which reduces the required electric power by reducing the loss due to antenna, and can improve the isolation of signals of a plurality of communications systems. SOLUTION: The antenna switching module is provided with an antenna switching module, in which at least a part of a switching circuit for switching a signal route between a transmitting circuit and a receiving circuit, respectively corresponding to different communication systems and antennas is formed in a multilayer base, comprising insulating layers and conducting layers laminated alternately. The antenna switching module has antenna terminals included in terminals, provided to a terminal surface of the multilayer base and is connected to the antennas whose pass bandwidths differ from each other, and the switching circuits connected to the respective antenna terminal. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种天线切换模块,其通过减少由天线引起的损耗来减少所需的电力,并且可以改善多个通信系统的信号的隔离。 解决方案:天线切换模块设置有天线切换模块,其中分别对应于不同的通信系统和天线的用于切换发送电路和接收电路之间的信号路由的切换电路的至少一部分是 形成在多层基体中,包括交替层叠的绝缘层和导电层。 天线切换模块具有包括在端子中的天线端子,提供给多层基底的端子表面,并且连接到通过带宽彼此不同的天线,以及连接到各个天线端子的开关电路。 版权所有(C)2008,JPO&INPIT

    High frequency switch module and wireless phone communication apparatus employing the same
    8.
    发明专利
    High frequency switch module and wireless phone communication apparatus employing the same 有权
    高频切换模块和无线电话通信设备

    公开(公告)号:JP2004260745A

    公开(公告)日:2004-09-16

    申请号:JP2003051703

    申请日:2003-02-27

    Abstract: PROBLEM TO BE SOLVED: To provide a high frequency switch module with a high shield effect of a transmission line and capable of decreasing transmission loss. SOLUTION: A high frequency signal processing circuit 2 is configured as a layered body 80 wherein a plurality of conductor layers including circuit conductor elements 111, 45, VA, 101 and 102 and a plurality of dielectric layers 50 are layered. The plurality of conductor layers include: the transmission line 111 and a ground planar conductor 101 as the circuit conductor elements; and an electrically neutral isolated conductor layer 130 isolated from the circuit conductor elements in terms of a DC. Then the transmission line 111 forms an isolated conductor layer accompanying a microstrip line which is sandwiched between a ground planar conductor 102 and the isolated conductor layer 130 in the thickness direction of the layered body 80. COPYRIGHT: (C)2004,JPO&NCIPI

    Abstract translation: 要解决的问题:提供具有传输线的高屏蔽效应并且能够降低传输损耗的高频开关模块。 解决方案:高频信号处理电路2被配置为层叠体80,其中层叠有包括电路导体元件111,45,VA,101和102以及多个电介质层50的多个导体层。 多个导体层包括:传输线111和作为电路导体元件的接地平面导体101; 以及与DC电路绝缘的电中性隔离导体层130。 然后,传输线111在层叠体80的厚度方向上形成伴随着微带线的隔离导体层,该导体层夹在地平面导体102和隔离导体层130之间。(C)2004,JPO&NCIPI

    Antenna switch module for multiband
    9.
    发明专利

    公开(公告)号:JP2004104524A

    公开(公告)日:2004-04-02

    申请号:JP2002264635

    申请日:2002-09-10

    Abstract: PROBLEM TO BE SOLVED: To provide an antenna switch module for a multiband which interrupts harmonic noise generated from a power amplifier and also interrupts harmonic noise generated when a transmitted signal passes through a diode constituting a high frequency switch.
    SOLUTION: This antenna switch module for a multiband comprises: a branching filter circuit connected to a filter circuit composed of a first inductance element; a first high frequency switch for switching a transmitting circuit and a receiving circuit for the lowest frequency band among a plurality of frequency bands divided by the branching filter circuit; and a second high frequency switch for switching a transmitting circuit and a receiving circuit for a plurality of different frequency bands other than the lowest frequency band.
    COPYRIGHT: (C)2004,JPO

    Antenna switch module for multiband
    10.
    发明专利
    Antenna switch module for multiband 审中-公开
    天线开关模块

    公开(公告)号:JP2004104523A

    公开(公告)日:2004-04-02

    申请号:JP2002264634

    申请日:2002-09-10

    Abstract: PROBLEM TO BE SOLVED: To provide an antenna switch module for a multiband which corresponds at lease four or more different frequency bands and has little transmission loss without having the possibility that noise such as interference and signal leakage occurs in a multilayer substrate. SOLUTION: This antenna switch module for a multiband comprises a first high frequency switch which is connected to a branching filter circuit and switches a transmitting circuit and a receiving circuit for two different frequency bands, a second high frequency switch for switching a transmitting circuit and a receiving circuit for two different frequency bands other than the two different frequency bands switched by the first high frequency switch, and first and second filter circuits connected between an antenna terminal and the first and second high frequency switches. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:提供一种用于多频带的天线切换模块,其对应于至少四个或更多个不同的频带,并且传输损耗小,而不会在多层基板中发生诸如干扰和信号泄漏的噪声。 解决方案:用于多频带的该天线切换模块包括第一高频开关,其连接到分支滤波器电路并切换用于两个不同频带的发射电路和接收电路,第二高频开关用于切换发射 电路和用于由第一高频开关切换的两个不同频带之外的两个不同频带的接收电路,以及连接在天线端子与第一和第二高频开关之间的第一和第二滤波器电路。 版权所有(C)2004,JPO

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