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公开(公告)号:EP4373210A1
公开(公告)日:2024-05-22
申请号:EP22842171.5
申请日:2022-07-14
Applicant: NHK Spring Co., Ltd.
Inventor: YOSHIDA, Atsuki , YAMAUCHI, Yuichiro , MIZUTA, Hidetoshi
Abstract: An induction heating device (20) according to one embodiment includes a first coil portion (30) and a second coil portion (40). A bar-shaped workpiece is placed between the first coil portion (30) and the second coil portion (40). The first coil portion (30) includes a pair of first narrow pitch portions (71,72) formed in respective end portions thereof, a first wide pitch portion (73,74) formed between the first narrow pitch portions (71,72), and a first medium pitch portion (75) formed in the center. The second coil portion (40) includes a pair of second narrow pitch portions (111,112) formed in respective end portions, a second wide pitch portion (113,114) formed between the second narrow pitch portions (111,112), and a second medium pitch portion (115) formed in the center.
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公开(公告)号:EP4417400A1
公开(公告)日:2024-08-21
申请号:EP22880906.7
申请日:2022-10-06
Applicant: NHK Spring Co., Ltd.
Inventor: MIZUTA, Hidetoshi , FURUSE, Atom , NAGASAWA, Kaoru , ARAI, Fumitaka
IPC: B29C65/48 , B60G21/055 , F16B11/00 , C09J5/06 , C09J201/00 , B29C65/02 , B29C65/14 , B29C65/44 , B29C65/46 , B29C65/52 , B29L31/30 , B29L31/00 , B29C35/08
CPC classification number: C09J5/06 , C09J201/00 , B60G21/055 , B29C65/4835 , B29L2031/305520130101 , B29L2031/72120130101 , B29C65/44 , B29C65/46 , B29C66/0242 , B29C66/543 , B29C66/53241 , B29C65/02 , B29C66/8322 , B29C66/91411 , B29C66/944 , B29C65/48 , B29C66/532 , F16B11/006 , B29C66/1122 , B29C65/522 , B29C66/028 , B29C66/71 , B29C66/7212 , B29C66/742 , B29C66/73751 , B29C66/73753 , B29C65/1412 , B29C2035/082220130101 , B29C65/1416
Abstract: A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.
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