公开(公告)号：DE602009001233D1

公开(公告)日：2011-06-16

申请号：DE602009001233

申请日：2009-12-07

Applicant: NICHIA CORP

Inventor： HAYASHI MASAKI ,  TAGUCHI YUSUKE ,  TOMIYOSHI KAZUTOSHI ,  TADA TOMOYOSHI

IPC: C08L63/00 ,  H01L23/29

公开(公告)号：JP2010138347A

公开(公告)日：2010-06-24

申请号：JP2008318429

申请日：2008-12-15

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： HAYASHI MASAKI ,  TAGUCHI YUSUKE ,  TOMIYOSHI KAZUTOSHI ,  TADA TOMOYOSHI

IPC: C08G59/14 ,  C08K3/00 ,  C08K3/22 ,  C08K3/34 ,  C08K5/101 ,  C08K5/103 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C08G59/3245 ,  C08G59/186 ,  C08G59/42 ,  C08L63/00 ,  C08L63/06 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition giving a cured product, which is homogeneous and maintains whiteness, heat resistance and light resistance for a long period of time with reduced yellowing, and to provide a semiconductor device comprising a semiconductor element encapsulated with a cured product of the above composition. SOLUTION: The thermosetting epoxy resin composition contains, as essential components, (A) a reaction product of a triazine derivative epoxy resin and an acid anhydride, (B) an internal mold release agent, (C) a reflective member (D) an inorganic filler and (E) a curing catalyst, wherein the internal mold release agent comprises both of a carboxylate ester represented by formula (1):R 11 -COO-R 12 and a compound represented by formula (2). In formula (2), R 1 , R 2 and R 3 are selected from H, -OH, -OR and -OCOC a H b with the proviso that at least one includes -OCOC a H b ; R is C n H 2n+1 (wherein n is an integer of 1 to 30); a is 10 to 30; and b is 17 to 61. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种固化产物的热固性环氧树脂组合物，该固化产物是均匀的，并且在黄色减少的情况下长时间保持白度，耐热性和耐光性，并且提供一种半导体器件，包括 用上述组合物的固化产物包封的半导体元件。 解决方案：热固性环氧树脂组合物含有（A）三嗪衍生物环氧树脂与酸酐的反应产物，（B）内部脱模剂，（C）反射构件（D） ）无机填料和（E）固化催化剂，其中所述内部脱模剂包含由式（1）表示的羧酸酯：R 11和R 10， SP＆gt;和式（2）表示的化合物。 在式（2）中，R 1，R 2，R 3和R 3选自H，-OH，-OR和-OCOC a H b ，条件是至少一个包括-OCOC a H ; R为C H 2n + 1 （其中n为1〜30的整数）。 a是10到30; b为17至61.版权所有（C）2010，JPO＆INPIT