公开(公告)号：KR20200125752A

公开(公告)日：2020-11-04

申请号：KR20207030577

申请日：2009-08-27

Applicant: NICHIA CORP

Inventor： ICHIKAWA HIROFUMI ,  HAYASHI MASAKI ,  SASAOKA SHIMPEI ,  MIKI TOMOHIDE

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L33/00 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: 리드프레임과열경화성수지조성물과의밀착성이높고, 단시간에다수개의발광장치를제조하는간이하고또한염가의방법을제공하는것을목적으로한다. 열경화후의, 파장 350㎚∼800㎚에서의광 반사율이 70% 이상이고, 외측면(20b)에서수지부(25)와리드(22)가대략동일면에형성되어있는수지패키지(20)를갖는발광장치의제조방법으로서, 절결부(21a)를형성한리드프레임(21)을상부금형(61)과하부금형(62) 사이에끼워넣는공정과, 상부금형(61)과하부금형(62) 사이에끼워넣어진금형(60) 내에, 광반사성물질(26)이함유되는열경화성수지(23)를트랜스퍼몰드하여, 리드프레임(21)에수지성형체(24)를형성하는공정과, 절결부(21a)를따라서수지성형체(23)와리드프레임(21)을절단하는공정을갖는발광장치의제조방법에관한것이다.

公开(公告)号：EP2490269A4

公开(公告)日：2014-07-30

申请号：EP10823352

申请日：2010-10-08

Applicant: NICHIA CORP

Inventor： HAYASHI MASAKI

IPC: H01L33/48

CPC classification number: H01L33/486 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/34 ,  B29C2045/0027 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a high-quality light-emitting device including a resin package having a recessed portion, which is able to be easily and reliably manufactured while securing higher strength. The light emitting device includes a light emitting element 2, a resin package 10 defining a recessed portion 105 serving as a mounting region of the light emitting element 2, gate marks 5a, 5b each formed on an outer side surface of the resin package 10, and leads 20, 30 disposed on the bottom surface of the recessed portion 105 and electrically connected to the light emitting element 2. The light emitting element 2 is mounted on the lead 20. The gate marks include a first gate mark 5a formed on a first outer side surface 11a of the resin package 10 and a second gate mark 5b formed on an outer side surface which is different than the first outer side surface 11 a.

公开(公告)号：EP2112697A4

公开(公告)日：2011-05-11

申请号：EP07850551

申请日：2007-12-13

Applicant: NICHIA CORP

Inventor： HAYASHI MASAKI

IPC: H01L33/00 ,  H01L33/52

CPC classification number: B29C45/0025 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0027 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a light emitting device wherein a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. A light emitting device (1) is provided with a light emitting element (2); a first resin molded body (10) having a plurality of outer surfaces (11), and a recessed section (10a) at the center; a first lead (20) and a second lead (30) electrically connected to the light emitting element (2); and a second resin molded body (40) applied in the recessed section (10a). The light emitting element (2) is place on the first lead (20), and the surface of the second resin molded resin (40) is permitted to be a light emitting surface. A gate notch (50) obtained by cutting a gate formed on the outer surface (11) of the first resin molded body (10) is formed on an extended line of a normal line on one point on a circular cross-section of the recessed section (10a) in the normal nine direction.

Abstract translation: 提供一种发光器件，其中在中心具有圆形或椭圆形凹入部分的树脂成型体抑制裂纹的产生。 发光器件（1）设置有发光元件（2）; 具有多个外表面（11）的第一树脂成型体（10）和位于中心的凹部（10a）; 电连接到发光元件（2）的第一引线（20）和第二引线（30）; 和第二树脂成型体（40），其被涂敷在凹部（10a）中。 发光元件（2）位于第一引线（20）上，第二树脂模制树脂（40）的表面被允许为发光表面。 通过切割形成在第一树脂成型体（10）的外表面（11）上的浇口而获得的浇口凹口（50）形成在法线的延伸线上，该凹槽在凹陷的圆形横截面上的一个点上 （10a）在正常的九个方向。

公开(公告)号：EP2711995A4

公开(公告)日：2014-11-26

申请号：EP12786606

申请日：2012-05-15

Applicant: NICHIA CORP

Inventor： KURAMOTO MASAFUMI ,  IWAKURA DAISUKE ,  OZEKI KENJI ,  TSURUHA TOMOAKI ,  OKADA SATOSHI ,  HAYASHI MASAKI

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (40) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

公开(公告)号：EP2325901A4

公开(公告)日：2013-12-25

申请号：EP09811246

申请日：2009-08-27

Applicant: NICHIA CORP

Inventor： ICHIKAWA HIROFUMI ,  HAYASHI MASAKI ,  SASAOKA SHIMPEI ,  MIKI TOMOHIDE

IPC: H01L33/00 ,  B29C45/00 ,  B29C45/14 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).

公开(公告)号：DE602009001233D1

公开(公告)日：2011-06-16

申请号：DE602009001233

申请日：2009-12-07

Applicant: NICHIA CORP

Inventor： HAYASHI MASAKI ,  TAGUCHI YUSUKE ,  TOMIYOSHI KAZUTOSHI ,  TADA TOMOYOSHI

IPC: C08L63/00 ,  H01L23/29

公开(公告)号：EP2109157A4

公开(公告)日：2013-12-04

申请号：EP07860121

申请日：2007-12-26

Applicant: NICHIA CORP

Inventor： HAYASHI MASAKI

IPC: H01L33/48 ,  H01L21/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device, which can be efficiently manufactured and maintain a stable light emitting property for a long period, is provided. The light emitting device comprises a first resin forming body including a periphery that forms a recess to house a light emitting element and a bottom that forms a bottom portion of the recess, and a second resin forming body that covers the light emitting element. The first resin forming body is composed of a thermosetting epoxy resin composite whose essential component is an epoxy resin. The bottom covers surfaces of lead frames excluding mounting regions of the light emitting element and wires. A thickness of the bottom is formed thinner than a thickness from the surface of the lead frames to a leading end of the light emitting element.

公开(公告)号：JP2010062272A

公开(公告)日：2010-03-18

申请号：JP2008225408

申请日：2008-09-03

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： ICHIKAWA HIROSHI ,  HAYASHI MASAKI ,  SASAOKA SHINPEI ,  MIKI MICHIHIDE

IPC: H01L33/48

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a simple and inexpensive method of manufacturing a large number of light-emitting devices in a short time, which has high adhesion of a lead frame and a thermosetting resin composition. SOLUTION: The method of manufacturing the light-emitting device has a resin package 20 in which the optical reflectance in wavelength of 350 to 800 nm after thermal curing is ≥70%, and a resin part 25 and a lead 22 are formed on approximately the same surface in an outside surface 20b. The method has: a step of sandwiching a lead frame 21, in which a notch 21a is provided, with an upper metal mold 61 and an lower metal mold 62; a step of forming a resin molding 24 in a lead frame 21 by transfer-molding a thermosetting resin 23, which contains a light reflective material 26, in the metal mold 60 sandwiched by the upper metal mold 61 and the lower mold 62; and a step of cutting the resin molding 23 and the lead frame 21 along the notch 21a. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在短时间内制造大量发光装置的简单且便宜的方法，其具有高引线框架和热固性树脂组合物的粘附性。 解决方案：制造发光器件的方法具有树脂封装20，其中热固化后350至800nm波长的光反射率为≥70％，并且形成树脂部分25和引线22 在外表面20b上的大致相同的表面上。 该方法具有：将设置有切口21a的引线框架21与上金属模具61和下金属模具62夹持的步骤; 通过在夹在上金属模具61和下模具62的金属模具60中转印含有光反射材料26的热固性树脂23，在引线框架21中形成树脂模制件24的步骤; 以及沿着切口21a切割树脂模制件23和引线框架21的步骤。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008300694A

公开(公告)日：2008-12-11

申请号：JP2007146176

申请日：2007-05-31

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： HAYASHI MASAKI

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: B29C45/14655 ,  B29C45/1671 ,  F21K9/00 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0075 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a robust light-emitting device having high power and excellence in heat resistant property, light resistant property, and heat dissipating property, to provide a resin-molded body constituting the light-emitting device, and to provide a method of manufacturing them. SOLUTION: In an light-emitting device 1 having a plurality of light-emitting elements 2, a lead pair 6 made of a first lead 4 and a second lead 5 electrically connected to the light-emitting element 2 is located, each being insulated, substantially symmetric with a base 3 mounting the plurality of light-emitting elements 2 as a center. A first resin-molded item 11 that coats at least part of the base 3 and the lead pair 6 and integrates these into one unit and a second resin-molded item 12 that is filled in a recess part 13 formed in the first resin-molded item 11 are both made of thermosetting resin. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供具有高功率和优异的耐热性，耐光性和散热性的坚固的发光装置，以提供构成发光装置的树脂成型体，以及 以提供制造它们的方法。 解决方案：在具有多个发光元件2的发光装置1中，分别配置有与发光元件2电连接的由第一引线4和第二引线5构成的引线对6， 绝缘，与安装多个发光元件2为中心的基座3基本对称。 第一树脂成型品11，其涂覆基底3和引线对6的至少一部分，并将它们整合到一个单元中，第二树脂成型品12填充在形成在第一树脂模塑的凹部13中 项目11都由热固性树脂制成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008252148A

公开(公告)日：2008-10-16

申请号：JP2008188492

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mount type light-emitting device having excellent light resistance and mass productivity.
SOLUTION: The surface mount type light-emitting device has: a light-emitting element 10; a circuit board 20 on which the light-emitting element 10 is placed; a wall section 50 that is formed on the circuit board 20 and reflects light from the light-emitting element 10; and a light-transmitting sealing member 70 for covering the light-emitting element 10. The wall section 50 is formed of a thermosetting resin, adheres to the circuit board 20, and is formed by transfer molding.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供具有优异的耐光性和批量生产率的表面安装型发光装置的制造方法。 表面安装型发光装置具有：发光元件10; 其上放置有发光元件10的电路板20; 形成在电路板20上并反射来自发光元件10的光的壁部50; 以及用于覆盖发光元件10的透光密封构件70.壁部50由热固性树脂形成，粘附到电路板20上，并通过传递成型形成。 版权所有（C）2009，JPO＆INPIT