中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

43 records (took 0.023 seconds)

    PREPARATION OF SILVERRCONTAINING BLACK INK
    7.
    发明专利
    PREPARATION OF SILVERRCONTAINING BLACK INK 失效

    公开(公告)号：JPS5655467A

    公开(公告)日：1981-05-16

    申请号：JP13155179

    申请日：1979-10-12

    Applicant: NISSHA PRINTING

    Inventor： YAMAZAKI SEIICHI ,  NAKAGAWA EIJI ,  KITANO HISAO

    IPC: C03C21/00 ,  C03C17/00 ,  C09D11/00 ,  C09D11/02

    Abstract: PURPOSE:To prepare a silver-containing black ink suitable for a staining agent, a high-grade printed matter, by kneading a silver-containing black pigment recovered from a waste photographic film or a waste photograhic fixing solution, a resin and a solvent. CONSTITUTION:At least one silver-containing black pigment selected from an ash obtained, by the incineration of a waste photographic film containing silver or its mixture with a silver-containing precipitate recovered from a waste photographic fixing solution, in an oxidizing atomosphere for several hours, and a dried silver- containing precipitate powder obtained by heating a waste photographic fixing solution at 80-100 deg.C with addition of an anion such as nitric acid or sodium sulfide, combining with a silver ion, and drying the black silver-containing precipitate produced, a resin such as an acrylic resin or a cellulose resin, and a solvent such as toluene or ethyl acetate, are kneaded for several hours by means of a ball mill.

    ELECTROMAGNETIC WAVE SHIELDING BOARD AND ITS MANUFACTURE
    8.
    发明专利
    ELECTROMAGNETIC WAVE SHIELDING BOARD AND ITS MANUFACTURE 失效

    公开(公告)号：JPH1140976A

    公开(公告)日：1999-02-12

    申请号：JP20715197

    申请日：1997-07-15

    Applicant: NISSHA PRINTING

    Inventor： TAKEMURA HAJIME ,  NAKAGAWA EIJI ,  MASAKI KENICHI

    IPC: H05K9/00

    Abstract: PROBLEM TO BE SOLVED: To make it hard for conductor to be exfoliated from a substrate by laminating a surface substrate on a part or the whole of the exposed surface of conductor which is pushed in the surface layer of the substrate. SOLUTION: A conductor-fixed substrate 8, wherein conductor 4 is fixed on a surface substrate 6 is prepared. As the conductor 4, a fiber which has a large diameter and is covered with metal is used. For the conductor-fixed substrate 8, the fiber covered with a metal foil is patterned in a lattice type on a sheet-type surface substrate composed of polyethylene terephthalate and the like. The conductor 4 is fixed to the surface substrate 6 via a resin layer 7 which sticks the conductor 4 to a substrate 1, the surface substrate 6 to the conductor 4, and the surface substrate 6 to the substrate 1. The conductor 4 of the conductor-fixed substrate 8 is contact bonded to the substrate 1 which is softened by heating, and pushed in the surface layer of the substrate 1 to a degree such that exposed surfaces 5 are obtained. The conductor 4 is pushed in the substrate 1, so that the parts of the conductor 4 except the exposed surfaces are caught by the substrate 1. As a result the conductor 4 can be made hard to be exfoliated together with the surface substrate 6 from the substrate 1, when a part of the surface substrate 6 is exfoliated.

Patent Agency Ranking