Abstract:
The present invention relates to a resin for optical semiconductor element encapsulation containing a polyimide which is obtained by an imidation of a polyimide precursor obtained by a polycondensation of an aliphatic acid dianhydride with an aliphatic or aromatic diamine compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the present invention exhibits excellent advantages that it has a high light-transmitting property, is excellent in heat resistance, and shows an excellent light resistance even against short-wavelength light.
Abstract:
It is an object of the present invention to provide a composite semi-permeable membrane exhibiting excellent chemical resistance and having practical water permeability and salt-blocking property, and a method for producing the same. The present invention relates to a composite semi-permeable membrane, including a porous support and a skin layer formed on a surface of the porous support, wherein the porous support contains a thermosetting resin porous sheet having a three-dimensional network structure and pores communicating with each other and wherein the thermosetting resin porous sheet has an average pore diameter of 0.01 to 0.4 µm.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin sheet including thermosetting resin and a hardener which prevents in-plane unevenness.SOLUTION: In the method of manufacturing the resin sheet, a cylindrical or columnar resin hardened body is formed of a resin mixture including the thermosetting resin and the hardener, and the surface of the resin hardened body is cut at predetermined thickness, so as to prepare the resin sheet. During the preparation of the resin hardened body, after the resin mixture is agitated, it is made to leave at rest for hardening. The mixture is agitated again in the state where viscosity at 30-40°C of the mixture is 1,500-4,000 mPa s.