公开(公告)号：GB2523145A

公开(公告)日：2015-08-19

申请号：GB201402589

申请日：2014-02-14

Applicant: NOKIA TECHNOLOGIES OY

Inventor： HAQUE MD SAMIUL ,  WHITE RICHARD ,  KIVIOJA JANI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14

Abstract: A circuit board comprising a primary substrate 201 and a secondary substrate 202, the primary substrate comprising a recess 205 configured to receive the secondary substrate, and a conducting trace 206 which extends towards an edge of the recess, the secondary substrate comprising an electronic component 218 and a conducting trace which extends from the electronic component towards an edge of the secondary substrate, wherein the secondary substrate is positioned within the recess and attached to the primary substrate, and the conducting trace of the secondary substrate is joined to the conducting trace of the primary substrate to form an electrical connection between the electronic component and the primary substrate. The conducting traces on the two circuit boards can either be directly or indirectly joined, and can be aligned with one another. The recess may be a blind or through hole. The secondary substrate can be the same size and shape as the recess into which it is mounted.