公开(公告)号：WO1992019024A1

公开(公告)日：1992-10-29

申请号：PCT/US1992003176

申请日：1992-04-15

Applicant: NORTH AMERICAN SPECIALITIES CORPORATION

Inventor： NORTH AMERICAN SPECIALITIES CORPORATION ,  SEIDLER, Jack

IPC: H01R09/09

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/02 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K2203/041 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A solder-bearing lead (10) for attachment to the surface of a substrate (39), wherein a discrete mass of solder (24) is mechanically held firmly by the lead (10) in a position permitting close proximity to the substrate surface to connect the lead (10) to the substrate (39) with an electrical and mechanical bond upon melting of the solder (24), the lead body having a pair of fingers (22) partially encircling the solder mass (24) with a gap (32) between the fingers (22) providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate (39) to a second substrate (44), forming a bond between conductive areas (45, 46) on both substrates.

Abstract translation: 一种用于附接到基板表面的焊料引线（10），其中焊料（24）的离散质量被引线（10）牢固地机械地保持在允许接近基板表面的位置 在焊料（24）熔化时，将引线（10）连接到基板（39）上并具有电和机械结合，所述引线主体具有一部分部分地围绕所述焊料块（24）的指状物（22） 指状物（22）之间提供用于熔化的焊料到衬底的畅通无阻的流动。 引线还可以用于将第一衬底（39）互连到第二衬底（44），在两个衬底上的导电区域（45,46）之间形成结合。