Abstract:
A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover with a V-groove defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on a transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. An expandable structure applies a compressive force between the first and second point of support of the transfer member along a compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal applied to a heating element in the expandable structure reduces the compressive force, switching the transfer member to a second state.
Abstract:
A method of field-assisted fusion bonding produces multiple-layer devices. Contacts (301, 303, 305, 307, 309) are placed at various points along different surfaces of a combination of two or more wafers (201, 203, 205, 501, 503, 505, 801, 803). An electric field is applied to the contacts (301, 303, 305, 307, 309), thereby creating an electrostatic attractive force between the wafers (201, 203, 205, 501, 503, 505, 801, 803). The temperature of the wafer combination is elevated to a fusion bonding temperature while the electric field is applied.
Abstract:
An apparatus in one example includes a die (102) such as a micro-electro-mechanical-system (MEMS) with at least first and second the first portion of the die mechanically and electrically circuit board (310). The apparatus includes an integrated circuit component (1220) mechanically and electrically connected with the second portion of the die. Upon operation the die servers to generate one or more electrical signals that are passed to the integrated circuit component.
Abstract:
An integrated rate and accelerometer sensor includes two counter vibrating tuned accelerometers formed in a single substantially planar silicon body to form the sensing element. The two vibrating accelerometers are interleaved in a manner that places their respective centers of mass in the same line parallel to the direction of the vibration and has the centers of percussion of the two (pendulum) proof masses coincident. A phase insensitive quadrature nulling method is utilized for each of the two vibrating accelerometers. The sensor structure utilizes Pyrex for the top and bottom covers. Metalized electrodes, feedthrus and contact pads are also utilized for the sensing element, instead of interlayer wire bonds.
Abstract:
An apparatus in one example comprises a first proofmass employable to sense a first acceleration along a first input axis; a second proofmass employable to sense a second acceleration along a second input axis; and a third proofmass employable to sense a third acceleration along a third input axis. The first input axis, the second input axis, and the third input axis are substantially orthogonal. The first proofmass, the second proofmass, and the third proofmass are substantially coplanar. Cavities in the proofmasses serve to locate the center of gravity. The input axes may be located such that they intersect at a common point and are orthogonal to each other.
Abstract:
A drive component that comprises a drive axis, a pendulous sensor component that comprises a center of mass, and a hinge component that comprises a rotation axis of an electromechanical system. The drive component makes a determination of a drive direction. Upon the determination of the drive direction, the drive component determines an alignment of a pendulous axis, that intersects the center of mass of the pendulous sensor component and the rotation axis of the hinge component, with the drive axis of the drive component. The drive component and the pendulous sensor component are coupled with the hinge component. A location of the hinge component causes the alignment of the pendulous axis to be substantially parallel with the drive direction of the drive component.
Abstract:
An apparatus (100) in one example includes a compliant component (104, 106, 108, 110, 112, 114, 116, 118) for supporting an electrical interface component (120, 122, 124, 126, 128, 130, 132, 134) that serves to electrically and mechanically couple a die (102) with a separate layer. In one example, the compliant component, (104, 106, 108, 110, 112, 114, 116, 118) upon relative movement between the die (102) and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus (100) in another example includes a compliant component (104, 106, 108, 110, 112, 114, 116, 118) for supporting an electrical interface component (120, 122, 124, 126, 128, 130, 132, 134) that serves to create an electrical connection between a die (102) and a separate layer. The compliant component (104, 106, 108, 110, 112, 114, 116, 118), upon relative movement between the die (102) and the separate layer, serves to promote maintenance of the electrical connection.
Abstract:
Quadrature error occurs in Corolis based vibrating rate sensors because of manufacturing flaws that permit the sensing element to oscillate either linearly along or angularly about an axis that is not orthogonal to the output axis. This create an oscillation along or about the output axis that is a component of the sensing element's vibration acceleration. This output axis oscillation is in phase with the driven acceleration of the sensing element and is called quadrature error since it is ninety degrees out of phase with the angular rate induced Coriolis acceleration. Rather than applying forces that reorient the axis of the driven vibration to be orthogonal to the output axis to eliminate the output axis oscillation, the present invention applies sinusoidal forces to the sensing element by means of a quadrature servo to cancel the output oscillation. In order to avoid the phase uncertainty associated with electronic modulation, the quadrature servo feeds back a DC signal that is modulated mechanically by means of an interdigitated variable area electrostatic forcer.
Abstract:
An apparatus comprising one or more heating elements or one ore more electrostatic elements and one or more elongated beams. The heating element or the electrostatic element is coupled with the elongated beam and induces a time-varying thermal gradient in or a time-varying voltage that creates an electrostatic force on the elongated beam to cause one or more oscillations of one or more of the one or more elongated beams.