公开(公告)号：EP2584349A1

公开(公告)日：2013-04-24

申请号：EP11185741.3

申请日：2011-10-19

Applicant: NXP B.V.

Inventor： Suy, Hilco ,  Frederix, Filip ,  Steenwinckel, David ,  Hoofman, Romano

IPC: G01N27/22 ,  C12Q1/68 ,  G01N33/543

CPC classification number: C12Q1/6816 ,  G01N33/5438 ,  C12Q2565/607

Abstract: A semiconductor chip, apparatus, and associated method are disclosed wherein the semiconductor chip, having at least one electrode and configured as a sensor such as a biosensor, is removably attachable to a tip of a dipstick. The dipstick tip, with the attached semiconductor chip, is arranged to be dipped into a well containing an analyte. The well may be part of a micro-titre plate. The chip electrically senses the presence of a target molecule, such as a bio-molecule, in the analyte. The sensing may typically be by means of a change in a capacitance associated with the electrode which occurs in the presence of the target molecule. The apparatus may include a plurality of dipsticks and associated semiconductor chips which are sensitive for different target molecules. Alternatively or in addition, a single semiconductor chip may have a plurality, many or even many thousands of electrodes, which may be sensitive to different target molecules.

Abstract translation: 公开了半导体芯片，装置和相关方法，其中具有至少一个电极并被配置为诸如生物传感器的传感器的半导体芯片可拆卸地附接到量油尺的尖端。 配有附着的半导体芯片的量油尺尖被布置成浸入含有分析物的孔中。 该井可能是微滴定板的一部分。 该芯片电学检测分析物中目标分子如生物分子的存在。 感测通常可以通过在靶分子的存在下发生的与电极相关的电容的变化。 该装置可以包括对不同的靶分子敏感的多个骰子和相关联的半导体芯片。 或者或另外，单个半导体芯片可以具有可能对不同靶分子敏感的多个，多个或甚至数千个电极。

公开(公告)号：EP2557420B1

公开(公告)日：2015-10-14

申请号：EP11177457.6

申请日：2011-08-12

Applicant: NXP B.V.

Inventor： Steenwinckel, David ,  Merelle, Thomas ,  Widdershoven, Franciscus ,  Hoang, Viet Nguyen ,  Soccol, Dimitri ,  Fransaer, Jan

IPC: G01N33/487 ,  G01N33/543 ,  H01M4/90

CPC classification number: G01N27/4145 ,  G01N27/3275 ,  H01L29/66

公开(公告)号：EP2557420A1

公开(公告)日：2013-02-13

申请号：EP11177457.6

申请日：2011-08-12

Applicant: NXP B.V.

Inventor： Steenwinckel, David ,  Merelle, Thomas ,  Widdershoven, Franciscus ,  Hoang, Viet Nguyen ,  Soccol, Dimitri ,  Fransaer, Jan

IPC: G01N33/487 ,  G01N33/543 ,  H01M4/90

CPC classification number: G01N27/4145 ,  G01N27/3275 ,  H01L29/66

Abstract: A method of manufacturing a biosensor semiconductor device is disclosed, in which copper electrodes at the major surface of the semiconductor devices are modified to form Au-Cu alloy electrodes. The modification is effected by depositing, typically by sputtering, a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper and to alloy them. The alloyed gold-copper is removed from the surface of the device typically by CMP, leaving the exposed electrodes. Since the gold-copper alloy is harder than gold, the CMP process window is wider than would be the case of pure gold; moreover, since the electrode copper has been converted to a gold-copper alloy, it is more corrosion resistant than a conventional copper electrode. The electrodes are thus better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes.
A biosensor semiconductor device having Au-Cu alloy electrodes is also disclosed.

Abstract translation: 公开了一种制造生物传感器半导体器件的方法，其中在半导体器件的主表面处的铜电极被改性以形成Au-Cu合金电极。 通过在器件上通常溅射金层，然后热处理器件以促进金和电极铜之间的相互扩散并使它们合金来实现该修改。 合金化的金 - 铜通常通过CMP从器件的表面去除，留下暴露的电极。 由于金铜合金比金更硬，CMP工艺窗口比纯金更宽; 此外，由于电极铜已经被转化为金 - 铜合金，因此比常规的铜电极更耐腐蚀。 因此，与常规铜电极的情况相比，电极与生物传感器装置的进一步处理更好地兼容，并且处理窗口比金盖铜电极宽。 还公开了具有Au-Cu合金电极的生物传感器半导体器件。