WAFER LEVEL MEMS FORCE DIES
    2.
    发明申请
    WAFER LEVEL MEMS FORCE DIES 有权
    WAFER LEVEL MEMS力量

    公开(公告)号:US20130341742A1

    公开(公告)日:2013-12-26

    申请号:US13924047

    申请日:2013-06-21

    Inventor: Amnon Brosh

    Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.

    Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件,例如梁或隔膜,其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本,焊接在裸片的外边缘处实现。 对于膜片版本,键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量,以提供过载保护。

    Wafer level MEMS force dies
    4.
    发明授权
    Wafer level MEMS force dies 有权
    晶圆级MEMS力模

    公开(公告)号:US09493342B2

    公开(公告)日:2016-11-15

    申请号:US13924047

    申请日:2013-06-21

    Inventor: Amnon Brosh

    Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.

    Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件,例如梁或隔膜,其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本,焊接在裸片的外边缘处实现。 对于膜片版本,键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量,以提供过载保护。

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