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公开(公告)号：US20160332866A1
公开(公告)日：2016-11-17
申请号：US15111044
申请日：2015-01-13
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
IPC: B81B3/00
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
Abstract translation: 这里描述的是由基座和盖组成的小型化和加固的晶片级MEMS力传感器。 传感器采用多个柔性膜，机械过载停止，挡土墙和压阻应变计。
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公开(公告)号：US20130341742A1
公开(公告)日：2013-12-26
申请号：US13924047
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件，例如梁或隔膜，其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本，焊接在裸片的外边缘处实现。 对于膜片版本，键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量，以提供过载保护。
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Patent Agency Ranking
公开(公告)号：US20180179050A1
公开(公告)日：2018-06-28
申请号：US15904631
申请日：2018-02-26
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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公开(公告)号：US09493342B2
公开(公告)日：2016-11-15
申请号：US13924047
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.
Abstract translation: 本文描述了包括耦合到传感器的间隔件的复合晶片级MEMS力模。 传感器包括至少一个柔性传感元件，例如梁或隔膜，其具有形成在其上的一个或多个传感器元件。 连接到传感器元件的接合垫放置在传感器的外周。 保护柔性感测元件和引线接合垫的间隔件被粘合到传感器上。 对于光束版本，焊接在裸片的外边缘处实现。 对于膜片版本，键合在芯片的中心实现。 间隔器和传感器之间的内部间隙允许柔性传感元件偏转。 该间隙也可用于限制柔性传感元件的偏转量，以提供过载保护。
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公开(公告)号：US09487388B2
公开(公告)日：2016-11-08
申请号：US13923998
申请日：2013-06-21
Applicant: NextInput, Inc.
Inventor： Amnon Brosh
CPC classification number: B81B3/0072 , B81B3/0021 , B81C1/00158 , B81C1/00666 , G01L1/044 , G01L1/18 , G01L5/0028 , G01L5/0057 , G01L5/162
Abstract: Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.
Abstract translation: 这里描述的是由平台和硅传感器组成的坚固耐用的晶片级MEMS力模。 硅传感器采用多个灵活的感应元件，它们包含压阻应变片和引线键。
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公开(公告)号：US09902611B2
公开(公告)日：2018-02-27
申请号：US15111044
申请日：2015-01-13
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
CPC classification number: B81B3/0056 , B81B2201/0264 , B81B2201/0292 , B81C1/00626 , G01L1/18 , G01L1/205 , G01L9/0047 , G01L9/0048
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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公开(公告)号：US20200024126A1
公开(公告)日：2020-01-23
申请号：US16254968
申请日：2019-01-23
Applicant: NextInput, Inc.
Inventor： Amnon Brosh , Ryan Diestelhorst , Steven Nasiri
Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.
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