公开(公告)号：WO2005011877A3

公开(公告)日：2005-02-10

申请号：PCT/FR2004/002043

申请日：2004-07-29

Applicant: NOVATEC ,  BOURRIERES, Francis ,  KAISER, Clément ,  CICERO, Antonio ,  NOVELLO, Osvaldo

Inventor： BOURRIERES, Francis ,  KAISER, Clément ,  CICERO, Antonio ,  NOVELLO, Osvaldo

IPC: H05K3/28

Abstract: L'invention concerne un procédé et un dispositif de remplissage sans masque ou écran de sérigraphie de zones situées en creux (4) non débouchantes par rapport à la surface d'un substrat (1). Selon l'invention, ce procédé consiste à associer dans l'ordre selon le sens de déplacement relatif d'une tête (12) du produit de remplissage (2), par rapport au substrat (1):- un élément d'étalement (10) du produit à remplir (2) à la surface du substrat (1),- un élément de mise en mouvement (3) du produit de remplissage (2) au niveau de la zone à remplir (4),- un élément (7) de réglage de l'épaisseur ou de raclage de l'excès de produit de remplissage (2), de manière à ce que le susdit produit de remplissage (2) reste constamment en contact avec la zone à remplir (4) du début du remplissage jusqu'au raclage de l'excès.

公开(公告)号：EP1649734A2

公开(公告)日：2006-04-26

申请号：EP04767817.2

申请日：2004-07-29

Applicant: Novatec

Inventor： BOURRIERES, Francis ,  KAISER, Clément ,  CICERO, Antonio ,  NOVELLO, Osvaldo

IPC: H05K3/28

CPC classification number: B05C3/18 ,  H05K3/28 ,  H05K3/4053 ,  H05K2201/09881 ,  H05K2203/0139 ,  H05K2203/0143

Abstract: The invention relates to a method and device for filling areas located in hollows (4) which do not open out onto the surface of a substrate (1) without a mask or silk screen. According to the invention, said method consists in associating the following objects according to the order of the direction of relative displacement of a head (12) of a filling product (2) in relation to the substrate (1) i.e. a spreading element (10) for the product to be filled (2) on the surface of the substrate (1); an element for displacing (3) the filling product (2) in the area to be filled (4); an element (7) for adjusting the thickness or raking off the excess filling product (2) such that the above-mentioned filling product (2) remains constantly in contact with the area to be filled (4) from the beginning of the filling operation until raking off of the excess product.

公开(公告)号：EP1649734B1

公开(公告)日：2006-11-15

申请号：EP04767817.2

申请日：2004-07-29

Applicant: Novatec

Inventor： BOURRIERES, Francis ,  KAISER, Clément ,  CICERO, Antonio ,  NOVELLO, Osvaldo

IPC: H05K3/28

CPC classification number: B05C3/18 ,  H05K3/28 ,  H05K3/4053 ,  H05K2201/09881 ,  H05K2203/0139 ,  H05K2203/0143

Abstract: The invention relates to a method and device for filling areas located in hollows (4) which do not open out onto the surface of a substrate (1) without a mask or silk screen. According to the invention, said method consists in associating the following objects according to the order of the direction of relative displacement of a head (12) of a filling product (2) in relation to the substrate (1) i.e. a spreading element (10) for the product to be filled (2) on the surface of the substrate (1); an element for displacing (3) the filling product (2) in the area to be filled (4); an element (7) for adjusting the thickness or raking off the excess filling product (2) such that the above-mentioned filling product (2) remains constantly in contact with the area to be filled (4) from the beginning of the filling operation until raking off of the excess product.