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公开(公告)号：CA2366618A1
公开(公告)日：2002-07-04
申请号：CA2366618
申请日：2002-01-04
Applicant: OPTICNET INC
Inventor： YUN WEIJIE , LIM MARTIN
Abstract: A self aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch wi th a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.
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