Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips
    2.
    发明申请
    Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips 审中-公开
    用于两个组装的垂直半导体芯片的自对准电气互连

    公开(公告)号:US20020085796A1

    公开(公告)日:2002-07-04

    申请号:US09754940

    申请日:2001-01-04

    Applicant: OpticNet, Inc.

    CPC classification number: B81B7/0006

    Abstract: A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.

    Abstract translation: 用于两个组装的垂直半导体芯片的自对准电互连由具有金属迹线的凹口的载体芯片中的槽形成。 另一个器件芯片垂直放置在插槽中,并具有匹配的金属迹线。 然后通过迹线将芯片结合在一起,以提供组装的芯片的精细垂直对准。

    Latching mechanism for mems actuator and method of fabrication
    3.
    发明申请
    Latching mechanism for mems actuator and method of fabrication 失效
    用于MEMs致动器和制造方法的锁存机构

    公开(公告)号:US20020118084A1

    公开(公告)日:2002-08-29

    申请号:US09793307

    申请日:2001-02-26

    Applicant: OpticNet, Inc.

    Abstract: A latching mechanism for a MEMS actuator as, for example, a mirror in an NnullN fiber optic switch, maintains a thermally actuated mirror in its actuated position even in the event of a power interruption by a pair of clamps, which clamp against an actuator arm. Such actuator arm is thermally actuated by a bent beam type of thermal actuator. To provide for effective fabrication using the MEMS technique (microelectromechanical system), on for example, a silicon substrate where the entire moveable structure is a suspended mechanism, the clamps are fabricated in a normally closed position. In this position they typically interfere with the line of motion of an enlarged portion of an actuator arm being directly in the line of motion or with a post and slot technique.

    Abstract translation: 用于MEMS致动器的闩锁机构,例如NxN光纤开关中的反射镜,即使在通过一对夹持器的电力中断的情况下,也将热致动反射镜保持在其致动位置,夹钳紧贴致动器臂 。 这种致动器臂由弯曲梁式的热致动器热致动。 为了提供使用MEMS技术(微机电系统)的有效制造,例如,整个可移动结构是悬挂机构的硅衬底,夹具被制造在常闭位置。 在这个位置上,它们通常干扰直接位于运动线中的致动器臂的放大部分的运动线,或者通过柱和槽技术。

    METHOD OF FABRICATING VERTICAL ACTUATION COMB DRIVES
    4.
    发明申请
    METHOD OF FABRICATING VERTICAL ACTUATION COMB DRIVES 审中-公开
    制造垂直驱动梳齿器驱动器的方法

    公开(公告)号:WO03035542A3

    公开(公告)日:2003-10-16

    申请号:PCT/US0234459

    申请日:2002-10-26

    Applicant: OPTICNET INC

    Abstract: A method of fabricating a vertical actuation comb drive first etches a cavity in a semiconductive wafer; then the comb structure is etched, and the fixed part of the structure is deformed by an induced strain, by techniques such as boron doping, by adding a metal layer or a fixed oxide, or a mechanical latch or an additional plate electrode. In a manner known in the art, application of a voltage across the fingers of the comb produces a deflection either tilting or a vertical movement in the moveable portion of the comb drive.

    Abstract translation: 制造垂直致动梳状驱动器的方法首先蚀刻半导体晶片中的空腔; 然后蚀刻梳状结构,并且通过诸如硼掺杂的技术,通过添加金属层或固定氧化物,或者机械闩锁或附加平板电极,通过感应应变使结构的固定部分变形。 以本领域已知的方式,在梳齿的指状物上施加电压在梳齿驱动器的可移动部分中产生偏转或者倾斜或者垂直运动。

    METHOD OF FABRICATING VERTICAL ACTUATION COMB DRIVES
    5.
    发明申请
    METHOD OF FABRICATING VERTICAL ACTUATION COMB DRIVES 审中-公开
    制造垂直执行机构的方法

    公开(公告)号:WO2003035542A2

    公开(公告)日:2003-05-01

    申请号:PCT/US2002/034459

    申请日:2002-10-26

    Applicant: OPTICNET, INC.

    Abstract: A method of fabricating a vertical actuation comb drive first etches a cavity in a semiconductive wafer; then the comb structure is etched, and the fixed part of the structure is deformed by an induced strain, by techniques such as boron doping, by adding a metal layer or a fixed oxide, or a mechanical latch or an additional plate electrode. In a manner known in the art, application of a voltage across the fingers of the comb produces a deflection either tilting or a vertical movement in the moveable portion of the comb drive.

    Abstract translation: 制造垂直致动梳状驱动器的方法首先蚀刻半导体晶片中的空腔; 然后对梳状结构进行蚀刻,通过添加金属层或固定氧化物的机械闩锁或附加的平板电极,通过诱导应变,硼掺杂等技术使固定部分发生变形。 以本领域已知的方式,跨梳子的手指施加电压产生在梳子驱动器的可移动部分中的倾斜或垂直移动的偏转。

    BISTABLE LATCHING ACTUATOR FOR OPTICAL SWITCHING APPLICATIONS
    6.
    发明申请
    BISTABLE LATCHING ACTUATOR FOR OPTICAL SWITCHING APPLICATIONS 审中-公开
    用于光开关应用的双绞线执行器

    公开(公告)号:WO2004102240A1

    公开(公告)日:2004-11-25

    申请号:PCT/US2004/012981

    申请日:2004-04-28

    CPC classification number: G02B6/358 G02B6/3512 G02B6/357

    Abstract: Bistable latching actuator for use in optical fiber switching applications having a generally planar mechanism with an arm that carries a mirror for movement in a direction perpendicular to the plane of the mechanism, and a bistable mechanical latch for retaining the mirror in stable positions on opposite sides of the plane without contacting the arm. Movement between the two stable positions is initiated and damped with an electrostatic comb drive.

    Abstract translation: 用于光纤切换应用的双稳态闭锁致动器具有大致平面的机构,其具有臂,该臂具有在垂直于机构的平面的方向上运动的反射镜,以及用于将反射镜保持在相对侧的稳定位置的双稳态机械闩锁 不接触手臂。 启动两个稳定位置之间的运动并用静电梳驱动阻尼。

    Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips
    7.
    发明公开
    Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips 审中-公开
    Selbstjustierte elektrische Verbindungfürzwei senkrecht zusammengesetzte Halbleiterchips

    公开(公告)号:EP1221428A2

    公开(公告)日:2002-07-10

    申请号:EP02250033.4

    申请日:2002-01-04

    Applicant: OpticNet, Inc.

    CPC classification number: B81B7/0006

    Abstract: A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.

    Abstract translation: 用于两个组装的垂直半导体芯片的自对准电互连由具有金属迹线的凹口的载体芯片中的槽形成。 另一个器件芯片垂直放置在插槽中,并具有匹配的金属迹线。 然后通过迹线将芯片结合在一起以提供组装的芯片的精细垂直对准。

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