公开(公告)号：US11716815B2

公开(公告)日：2023-08-01

申请号：US17759348

申请日：2021-01-20

Applicant: OSRAM GmbH

Inventor： Michael Beck ,  Sebastian Jooss ,  Gerhard Behr

IPC: H05K1/00 ,  H05K1/18

CPC classification number: H05K1/184 ,  H05K2201/10106

Abstract: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

公开(公告)号：US10383209B2

公开(公告)日：2019-08-13

申请号：US15987950

申请日：2018-05-24

Applicant: Osram GmbH

Inventor： Philipp Helbig ,  Sebastian Jooss

IPC: H05K1/00 ,  H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K3/34 ,  H05K1/14 ,  F21V29/70 ,  H05K3/00 ,  H01L25/075 ,  F21Y115/10 ,  H05K1/11 ,  H01L33/62 ,  H05K1/18 ,  H01L33/64

Abstract: An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

公开(公告)号：US20180343735A1

公开(公告)日：2018-11-29

申请号：US15987950

申请日：2018-05-24

Applicant: Osram GmbH

Inventor： Philipp Helbig ,  Sebastian Jooss

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  F21V29/70 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0201 ,  F21V29/70 ,  F21Y2115/10 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K1/0265 ,  H05K1/111 ,  H05K1/145 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/341 ,  H01L2924/00014

Abstract: An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

公开(公告)号：US20230059982A1

公开(公告)日：2023-02-23

申请号：US17759348

申请日：2021-01-20

Applicant: OSRAM GmbH

Inventor： Michael Beck ,  Sebastian Jooss ,  Gerhard Behr

IPC: H05K1/18

Abstract: Please replace the Abstract with the following: In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.