公开(公告)号：US11588088B2

公开(公告)日：2023-02-21

申请号：US17183634

申请日：2021-02-24

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  David Racz ,  Matthias Sperl

IPC: H01L33/00 ,  H01L33/62 ,  H01L31/024 ,  H01L33/64 ,  H01L31/0224 ,  H01L31/02 ,  H01L33/38 ,  H01L33/54 ,  H01L31/0304 ,  H01L31/0352 ,  H01L33/06 ,  H01L33/30

Abstract: An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.

公开(公告)号：US20210313759A1

公开(公告)日：2021-10-07

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/00 ,  H01S5/40 ,  H01S5/02255 ,  H01S5/02257

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.

公开(公告)号：US11955767B2

公开(公告)日：2024-04-09

申请号：US17264662

申请日：2019-08-01

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  David Racz

IPC: H01S5/022 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/40

CPC classification number: H01S5/0087 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/4056 ,  H01S5/4087

Abstract: In an embodiment a radiation-emitting component includes a first semiconductor chip configured to generate first primary electromagnetic radiation, a second semiconductor chip configured to generate second primary electromagnetic radiation, a first conversion element configured to partially convert the first and/or the second primary electromagnetic radiation into a first secondary radiation, wherein the first semiconductor chip is a first semiconductor laser diode, wherein the first primary electromagnetic radiation is blue primary radiation and wherein the first secondary radiation is green secondary radiation and a first optical element arranged between radiation emitting surfaces of the first semiconductor chip and the second semiconductor chip, wherein the first optical element is reflective for the first primary radiation and the second primary radiation.

公开(公告)号：US11101251B2

公开(公告)日：2021-08-24

申请号：US16625231

申请日：2018-06-22

Applicant: OSRAM OLED GmbH

Inventor： Peter Brick ,  Christopher Wiesmann ,  Ulrich Streppel ,  David Racz ,  Christopher Kölper ,  Georg Roßbach

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60

Abstract: An optoelectronic component includes a carrier, wherein the carrier includes a surface, reflective barriers are formed over the surface of the carrier, the reflective barriers divide the surface of the carrier into pixels, each pixel respectively includes at least one optoelectronic semiconductor chip arranged on the surface of the carrier, the optoelectronic semiconductor chip is configured to emit electromagnetic radiation, the optoelectronic semiconductor chip includes an upper side, the upper side faces away from the surface of the carrier, and a reflective covering is arranged on the upper side of the optoelectronic semiconductor chip.

公开(公告)号：US20210184092A1

公开(公告)日：2021-06-17

申请号：US17183634

申请日：2021-02-24

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  David Racz ,  Matthias Sperl

IPC: H01L33/62 ,  H01L31/024 ,  H01L33/64 ,  H01L31/0224 ,  H01L31/02

Abstract: An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.

公开(公告)号：US11538964B2

公开(公告)日：2022-12-27

申请号：US16756846

申请日：2018-10-16

Applicant: Osram OLED GmbH

Inventor： David O'Brien ,  Desiree Queren ,  David Racz ,  Britta Goeoetz ,  Michael Schumann

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/38 ,  H01L33/46

Abstract: An optoelectronic semiconductor chip may include an active region configured to emit electromagnetic radiation during operation of said optoelectronic semiconductor chip. The optoelectronic semiconductor chip comprises conversion elements arranged to convert the wavelength of the electromagnetic radiation emitted by the active region during operation, and at least one barrier at least partially impermeable to the electromagnetic radiation emitted by the active region. The barrier is disposed in a lateral direction between the conversion elements, the lateral direction being parallel to the main extension plane of the semiconductor body, and the barrier extending transversely to the lateral direction. The active region has at least two emission regions which can be driven separately from each other, and each of the conversion elements is disposed in a radiation direction of the electromagnetic radiation emitted from one of the emission regions. A method for manufacturing an optoelectronic semiconductor chip is also disclosed.

公开(公告)号：US20200243728A1

公开(公告)日：2020-07-30

申请号：US16756846

申请日：2018-10-16

Applicant: Osram OLED GmbH

Inventor： David O'Brien ,  Desiree Queren ,  David Racz ,  Britta Goeoetz ,  Michael Schumann

IPC: H01L33/50 ,  H01L33/38 ,  H01L27/15 ,  H01L33/46

Abstract: An optoelectronic semiconductor chip may include an active region configured to emit electromagnetic radiation during operation of said optoelectronic semiconductor chip. The optoelectronic semiconductor chip comprises conversion elements arranged to convert the wavelength of the electromagnetic radiation emitted by the active region during operation, and at least one barrier at least partially impermeable to the electromagnetic radiation emitted by the active region. The barrier is disposed in a lateral direction between the conversion elements, the lateral direction being parallel to the main extension plane of the semiconductor body, and the barrier extending transversely to the lateral direction. The active region has at least two emission regions which can be driven separately from each other, and each of the conversion elements is disposed in a radiation direction of the electromagnetic radiation emitted from one of the emission regions. A method for manufacturing an optoelectronic semiconductor chip is also disclosed.