公开(公告)号：US11038090B2

公开(公告)日：2021-06-15

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US10263219B2

公开(公告)日：2019-04-16

申请号：US14917048

申请日：2014-08-28

Applicant: OSRAM OLED GmbH

Inventor： Christopher Wiesmann ,  Thomas Wehlus

IPC: H01L51/52

Abstract: A radiation-emitting component is disclosed. Embodiments of the invention relate to a radiation-emitting component with an organic layer stack which is arranged on a substrate. An outcoupling structure is arranged on a substrate face facing the organic layer stack, an additional optical layer is arranged between the substrate and the outcoupling structure, and the additional optical structure has a refractive index which is lower than the refractive index of the substrate, or the additional optical layer forms a mirror which has a selective angle and which only allows light that can be coupled out of the substrate at a substrate boundary surface facing away from the organic layer sequence to pass, the light being generated in the organic layer stack during operation.

公开(公告)号：US20210135068A1

公开(公告)日：2021-05-06

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US10833234B2

公开(公告)日：2020-11-10

申请号：US16480966

申请日：2018-03-05

Applicant: OSRAM OLED GmbH

Inventor： Christopher Wiesmann

IPC: H01L33/60 ,  H01L33/20 ,  H01L33/48 ,  H01L33/58 ,  H01L33/46

Abstract: An optoelectronic semiconductor component includes a semiconductor layer sequence that generates radiation, the semiconductor layer sequence has an emission side and a rear side opposite said emission side, a mirror for the generated radiation on the rear side, a carrier that is transmissive to the radiation generated, on the emission side, and a reflector housing on side surfaces of the carrier, the reflector housing is impermeable to the generated radiation and configured for diffuse reflection of generated radiation and includes a radiation exit opening, wherein at least one of a width of an opening in the reflector housing and an area of the radiation exit opening decrease(s) in a direction away from the emission side, and a maximum emission of the generated radiation takes place in an emission angle range of 30° to 60°, relative to a perpendicular to the emission side.

公开(公告)号：US11177416B2

公开(公告)日：2021-11-16

申请号：US16466641

申请日：2017-11-29

Applicant: OSRAM OLED GmbH

Inventor： Peter Brick ,  Ulrich Streppel ,  Christopher Wiesmann

IPC: H01L33/50 ,  H01L33/60

Abstract: An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

公开(公告)号：US11101251B2

公开(公告)日：2021-08-24

申请号：US16625231

申请日：2018-06-22

Applicant: OSRAM OLED GmbH

Inventor： Peter Brick ,  Christopher Wiesmann ,  Ulrich Streppel ,  David Racz ,  Christopher Kölper ,  Georg Roßbach

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60

Abstract: An optoelectronic component includes a carrier, wherein the carrier includes a surface, reflective barriers are formed over the surface of the carrier, the reflective barriers divide the surface of the carrier into pixels, each pixel respectively includes at least one optoelectronic semiconductor chip arranged on the surface of the carrier, the optoelectronic semiconductor chip is configured to emit electromagnetic radiation, the optoelectronic semiconductor chip includes an upper side, the upper side faces away from the surface of the carrier, and a reflective covering is arranged on the upper side of the optoelectronic semiconductor chip.