公开(公告)号：US20210135068A1

公开(公告)日：2021-05-06

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US11139415B2

公开(公告)日：2021-10-05

申请号：US16631847

申请日：2018-07-11

Applicant: OSRAM OLED GmbH

Inventor： Harald Jaeger ,  Daniel Leisen ,  Jens Eberhard ,  Ivar Tangring

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48

Abstract: An optoelectronic component may be produced by providing a temporary carrier, applying a functional film to the temporary carrier, arranging optoelectronic elements within openings of the functional film in such a way that the mounting sides are facing towards the temporary carrier. The optoelectronic elements are thicker than the functional film such that the elements protrude beyond the functional film in a direction away from the temporary carrier. The method may further include applying a potting compound laterally around the elements and covering the function film and curing the potting compound to form a potting. The method may further include cutting between the openings to create individual optoelectronic components.

公开(公告)号：US11038090B2

公开(公告)日：2021-06-15

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US20210126156A1

公开(公告)日：2021-04-29

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

公开(公告)号：US11211524B2

公开(公告)日：2021-12-28

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L31/18 ,  H01L33/50 ,  H01L33/54

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.