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    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component
    1.
    发明专利
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for the component 审中-公开
    半导体元件发射和/或接收电磁辐射，以及组件的外壳

    公开(公告)号：JP2011054986A

    公开(公告)日：2011-03-17

    申请号：JP2010247343

    申请日：2010-11-04

    Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

    CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor component in which joining between a used encapsulant and a housing base has poor resistance to mechanical stress and a still risk of a layer separation of an encapsulant from the housing base is reduced. SOLUTION: A semiconductor component includes at least one semiconductor chip 1 that emits and/or receives radiation, the semiconductor chip 1 disposed in a recess 2 of a housing base 3. The recess 2 has: a chip well 21 in which the semiconductor chip 1 is fixed; and a trench 22 which runs at least partway around the chip well 21 inside the recess 2. The housing base 3 has a wall 23 between the chip well 21 and the trench 22. An apex of the wall, when viewed from a bottom face of the chip well, lies below a level of a surface of a housing body 3 from which the recess 2 leads into the housing body 3, and an encapsulant 4 extends outward from the chip well 21 over the wall into the trench 22. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种半导体部件，其中使用的密封剂和壳体基座之间的接合具有差的抗机械应力，并且减小了密封剂与壳体基底的层分离的风险。 解决方案：半导体部件包括发射和/或接收辐射的至少一个半导体芯片1，半导体芯片1设置在壳体基座3的凹部2中。凹部2具有：芯片阱21，其中 半导体芯片1固定; 以及沟槽22，其至少部分地围绕凹槽2内的芯片井21延伸。壳体基座3在芯片井21和沟槽22之间具有壁23。当从底部的底面观察时，壁的顶点 芯片阱位于壳体3的表面的水平面以下，凹部2从该主体3的表面引导到壳体3中，并且密封剂4从芯片井21向外延伸到壁上进入沟槽22中。 版权所有（C）2011，JPO＆INPIT

    LIGHT SOURCE
    2.
    发明申请
    LIGHT SOURCE 审中-公开
    光源

    公开(公告)号：WO2004097946A3

    公开(公告)日：2005-08-25

    申请号：PCT/DE2004000800

    申请日：2004-04-15

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  GROETSCH STEFAN

    Inventor： BOGNER GEORG ,  GROETSCH STEFAN

    IPC: H01L33/58 ,  G02B27/14 ,  G02F1/13

    CPC classification number: H01L33/58 ,  G03B21/2033 ,  G03B21/208 ,  H04N9/3152 ,  H04N9/3164

    Abstract: The invention relates to a light source, particularly a projection light source for a projection system, comprising a multitude of semiconductor chips and at least two, preferably three different electromagnetic radiation-emitting types of chips with different emission spectra. Each semiconductor chip has a chip extraction surface via which the radiation is extracted. The light source also a multitude of primary optics elements, and a primary optics element is assigned to each semiconductor chip. Each primary optics element has a light input and a light output and reduces the divergence of at least one portion of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips are arranged with the primary optics elements in at least two interspaced groups so that the groups emit separate cones of light when the semiconductor chips are in operation. The separate cones of lights of the groups are superimposed by means of secondary optics to form a combined cone of light.

    Abstract translation: 本发明涉及一种光源，特别是投影光源的投影系统具有至少两个，优选三个多个半导体芯片，并且电磁辐射发射具有不同发射光谱，其中，每个半导体芯片具有芯片输出芯片位置，被辐射耦合输出。 此外，所述光源中的各种主光学元件，其中每个半导体芯片被分配一个主光学元件，其每一个具有光输入端和光输出，并通过它们的辐射的操作期间从半导体芯片发射的光的至少一部分的发散减小。 半导体芯片被布置成在至少两个局部地分开的组的主光学元件，使得该组中的半导体芯片的工作期间发射单独的光锥。 组的单独的光锥被叠加由二次光学器件的装置，以形成光的一个共同的光束。

    LIGHT-EMITTING DIODE
    6.
    发明申请
    LIGHT-EMITTING DIODE 审中-公开
    发光二极管

    公开(公告)号：WO2004109813A3

    公开(公告)日：2005-04-21

    申请号：PCT/DE2004000829

    申请日：2004-04-21

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  BRAUNE BERT ,  SCHMID JOSEF

    Inventor： BOGNER GEORG ,  BRAUNE BERT ,  SCHMID JOSEF

    IPC: H01L33/56 ,  H01L33/58 ,  H01L33/64 ,  H01L33/00

    CPC classification number: H01L33/56 ,  H01L33/58 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: The invention relates to a light-emitting diode which comprises, embedded in a casting compound (3) and fastened on a support (1), a radiation-emitting semiconductor chip (4) and a lens body (2), whereby the support (1) contains silicon or a ceramic material and the lens body (2) contains a glass. The casting compound (3) is preferably enclosed by the support (1) and the lens body (2) and preferably does not contain any ultraviolet radiation-sensitive polymers.

    Abstract translation: 一种发光二极管包括：在一个密封的化合物（3）嵌入在承载体（1）固定于发射辐射的半导体芯片（4），和一个透镜体（2），其中，所述承载体（1）的硅或陶瓷和透镜体（2）是玻璃 包含的内容。 密封化合物（3）优选地通过在支撑体（1）和所述透镜体（2）封闭，并且有利地不包含聚合物，其是对紫外辐射敏感。

    HEADLIGHT AND HEADLIGHT ELEMENT
    8.
    发明申请
    HEADLIGHT AND HEADLIGHT ELEMENT 审中-公开
    光和元

    公开(公告)号：WO2004088200A3

    公开(公告)日：2005-02-10

    申请号：PCT/DE2004000609

    申请日：2004-03-24

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  BOGNER GEORG ,  GROETSCH STEFAN ,  REILL JOACHIM

    Inventor： BOGNER GEORG ,  GROETSCH STEFAN ,  REILL JOACHIM

    IPC: B60Q1/04 ,  F21S8/10 ,  F21V5/00 ,  H01L33/58 ,  H01L33/60 ,  B60Q1/00 ,  F21S8/00

    CPC classification number: B60Q1/04 ,  F21S41/143 ,  F21S41/24 ,  F21S41/28 ,  F21S41/663 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  Y10S362/80

    Abstract: The invention relates to a headlight comprising a plurality of headlight elements which respectively comprise at least one semiconductor chip emitting electromagnetic radiation; a primary lens element reducing the divergence of an incident light passing through a light input; at least one headlight element output which is used to radiate part of the light of a headlight from the headlight element. At least one of the headlight element outputs is arranged in at least two groups such that the arrangement of at least one group and/or at least the overall arrangement of the headlight element outputs corresponds essentially to a desired radiation characteristic of the headlight, such that in particular a form arises substantially corresponding to the cross-sectional shape of a desired headlight beam, whereby the semiconductor chips belonging to the headlight element outputs of one group can be respectively operated independently from the other semiconductor chips. The invention relates to a headlight element which is suitable for use with said type of headlight.

    Abstract translation: 本发明涉及一种具有多个头灯的元件，其中的每一个包括的前照灯：至少一个电磁辐射的半导体芯片; 一个主光学元件，从而降低通过该光输入的光的入射的发散; 至少一个大灯元件输出，通过该前照灯的光的一部分从头灯元件发出。 至少一些所述头灯元件输出的被布置在至少两个组，使得和/或多个组的前灯元件输出的至少一个整体布置中，基本上对应于它提供了一种形式的前灯的期望的发射特性，特别地，基本的截面形状的基团中的至少一个的布置 对应于属于所述半导体芯片一组的前灯元件输出的期望前照灯锥体可以在每种情况下独立操作可采取的其他的半导体芯片。 本发明还涉及适合于这种头灯的头灯元件。

    OPTOELECTRONIC COMPONENT
    9.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开
    光电子器件

    公开(公告)号：WO2004051757A3

    公开(公告)日：2004-12-23

    申请号：PCT/DE0303923

    申请日：2003-11-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  WAITL GUENTER ,  WINTER MATTHIAS

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

    Abstract translation: 本发明涉及一种包括光电芯片（1），一个芯片载体的光电元件（2），其具有一个中心区域（3），在其上的芯片被固定，并用连接件（41，42，43，44）从中心区 点对称-从向外的芯片载体（2），其中由主体（5）的芯片和芯片载体的部分是有包膜的延伸，并且其中所述主体的所述突起和在芯片和芯片载体之间的接触面的连接器的纵向轴线各自基本上 到芯片的中心。 此外，本发明涉及具有该部件的布置。 由于设备的对称设计，这具有减小设备的热机械故障的风险的优点。

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