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公开(公告)号：US10333032B2
公开(公告)日：2019-06-25
申请号：US14915873
申请日：2014-08-08
Applicant: OSRAM Opto Semiconductors GmbH , Karoline Bernhard-Hofer
Inventor： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilman Eckert
IPC: H01L33/48 , H01L33/58 , H01L33/60 , H01L33/62 , H01L23/00 , H01L21/48 , H01L25/16 , H01L29/861 , H01L33/54 , H01L33/64
Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
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Patent Agency Ranking
公开(公告)号：US20150349222A1
公开(公告)日：2015-12-03
申请号：US14653835
申请日：2013-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Martin Haushalter , Frank Möllmer , Wilhelm Karsten , Heinz Haas
CPC classification number: H01L33/62 , H01L23/49548 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L51/5203 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.
Abstract translation: 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。
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公开(公告)号：US20160218248A1
公开(公告)日：2016-07-28
申请号：US14915873
申请日：2014-08-08
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Frank Möllmer , Markus Arzberger , Michael Schwind , Thomas Höfer , Martin Haushalter , Mario Wiengarten , Tilmann Eckert
CPC classification number: H01L33/486 , H01L21/4817 , H01L21/4821 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/165 , H01L25/167 , H01L29/861 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/005 , H01L2933/0066 , H01L2224/45099 , H01L2924/00
Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.
Abstract translation: 实施方案光电子半导体器件包括具有带有第一和第二连接导体的引线框的外壳。 壳体还具有在一个或多个区域中围绕引线框架的壳体主体。 壳体在壳体的安装侧和与安装侧相对的壳体的前侧之间沿垂直方向延伸。 第一连接导体具有凹部。 构造成产生辐射的半导体芯片布置在壳体内，并且半导体芯片设置在凹部中并且固定到凹部内的第一连接导体。 凹部的侧面形成用于反射所产生的辐射的反射器。 第一连接导体在安装侧从壳体主体突出。 在至少一些区域中，半导体芯片没有与半导体芯片相邻的封装材料。
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公开(公告)号：US20140307755A1
公开(公告)日：2014-10-16
申请号：US14352677
申请日：2012-09-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Josip Maric , Martin Haushalter , Frank Möllmer
IPC: H01S5/022
CPC classification number: H01S5/02236 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02296 , H01S5/0428 , H01L2924/00
Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least. in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.
Abstract translation: 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 使用塑料，连接位置（1a，1b）至少在每种情况下延伸。 在沿壳体（3）的底面（3a）和侧面（3b）的位置处，所述侧面相对于底面横向延伸，并且该部件通过连接位置（1a）可表面安装 ，1b），使得底面（3a）或侧面（3b）形成部件的安装面。
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公开(公告)号：US09379517B2
公开(公告)日：2016-06-28
申请号：US14352677
申请日：2012-09-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Josip Maric , Martin Haushalter , Frank Möllmer
CPC classification number: H01S5/02236 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02296 , H01S5/0428 , H01L2924/00
Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.
Abstract translation: 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 连接位置（1a，1b）至少在沿壳体（3）的底面（3a）和侧面（3b）的位置上延伸，所述侧面相对于所述壳体 并且该部件可以通过连接位置（1a，1b）以表面（3a）或侧面（3b）形成该部件的安装面的方式表面安装。
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公开(公告)号：US09318678B2
公开(公告)日：2016-04-19
申请号：US14653835
申请日：2013-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Wojcik , Martin Haushalter , Frank Möllmer , Wilhelm Karsten , Heinz Haas
CPC classification number: H01L33/62 , H01L23/49548 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L51/5203 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00 , H01L2924/00014
Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.
Abstract translation: 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。
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