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公开(公告)号:US12199134B2
公开(公告)日:2025-01-14
申请号:US17515338
申请日:2021-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Martin Behringer , Andreas Biebersdorf , Ruth Boss , Erwin Lang , Tobias Meyer , Alexander Pfeuffer , Marc Philippens , Julia Stolz , Tansen Varghese , Sebastian Wittmann , Siegfried Herrmann , Berthold Hahn , Bruno Jentzsch , Korbinian Perzlmaier , Peter Stauss , Petrus Sundgren , Jens Mueller , Kerstin Neveling , Frank Singer , Christian Mueller
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号:US12176469B2
公开(公告)日:2024-12-24
申请号:US17645644
申请日:2021-12-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Andreas Biebersdorf , Laura Kreiner , Stefan Illek , Ines Pietzonka , Petrus Sundgren , Christoph Klemp , Felix Feix , Christian Berger , Ana Kanevce
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号:US12057522B2
公开(公告)日:2024-08-06
申请号:US17632892
申请日:2020-07-23
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: Tansen Varghese , Petrus Sundgren
CPC classification number: H01L33/08 , H01L33/005 , H01L33/62 , H01L2933/0066
Abstract: Disclosed is method for making a component and a component comprising a substrate, a semiconductor element arranged on the substrate, an intermediate layer arranged at least in sections between the substrate and the semiconductor element, and a first contact structure, wherein the semiconductor element has a first semiconductor layer, a second semiconductor layer and an active zone, which is arranged in a vertical direction between the semiconductor layers and designed for generating electromagnetic radiation. The active zone has locally deactivated regions along lateral directions, which are not designed for generating electromagnetic radiation. The semiconductor element has an opening which extends through the second semiconductor layer and the active zone to the first semiconductor layer, wherein the opening is different from the deactivated regions of the active zone and is partially filled with a material of the intermediate layer.
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公开(公告)号:US20220254957A1
公开(公告)日:2022-08-11
申请号:US17614269
申请日:2020-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Philipp Kreuter , Andreas Biebersdorf , Christoph Klemp , Jens Ebbecke , Ines Pietzonka , Petrus Sundgren
Abstract: In an embodiment a method for manufacturing a semiconductor device include providing a growth substrate, depositing an n-doped first layer, depositing an active region on the n-doped first layer, depositing a second layer onto the active region, depositing magnesium (Mg) in the second layer and subsequently to depositing Mg, depositing zinc (Zn) in the second layer such that a concentration of Zn in the second layer decreases from a first value to a second value in a first area of the second layer adjacent to the active region, the first area being in a range of 5 nm to 200 nm.
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公开(公告)号:US20220238752A1
公开(公告)日:2022-07-28
申请号:US17615487
申请日:2020-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Jens Ebbecke , Philipp Kreuter , Christoph Klemp , Andreas Biebersdorf , Ines Pietzonka , Petrus Sundgren
IPC: H01L33/00
Abstract: Embodiments provide a method for treating a semiconductor wafer comprising a set of aluminum gallium indium phosphide light emitting diodes (AlGaInP-LEDs) to increase a light generating efficiency of the AlGaInP-LEDs, wherein each AlGaInP-LED includes a core active layer for light generation sandwiched between two outer layers, the core active layer having a central light generating area and a peripheral edge surrounding the central light generating area, wherein the method includes treating the peripheral edge of the core active layer of each AlGaInP-LED with a laser beam thereby increasing a minimum band gap in each peripheral edge to such an extent that, during operation of the AlGaInP-LED, an electron-hole recombination is essentially confined to the central light generating area.
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公开(公告)号:US20170271553A1
公开(公告)日:2017-09-21
申请号:US15532236
申请日:2015-11-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Andreas Rudolph , Petrus Sundgren , Ivar Tangring
Abstract: An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a p-type semiconductor region, an n-type semiconductor region, and an active layer arranged between the p-type semiconductor region and the n-type semiconductor region. The active layer is designed as a multiple quantum well structure, wherein the multiple quantum well structure has a first region of alternating first quantum well layers and first barrier layers and a second region having at least one second quantum well layer and at least one second barrier layer. The at least one second quantum well layer has an electronic band gap (EQW2) that is less than the electronic band gap (EQW1) of the first quantum well layers, and the at least one second barrier layer has an electronic band gap (EB2) that is greater than the electronic band gap (EB1) of the first barrier layers.
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公开(公告)号:US12294039B2
公开(公告)日:2025-05-06
申请号:US17753957
申请日:2020-03-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Andreas Biebersdorf , Stefan Illek , Felix Feix , Christoph Klemp , Ines Pietzonka , Petrus Sundgren , Christian Berger , Ana Kanevce
Abstract: A semiconductor structure comprises an n-doped first layer, a p-doped second layer doped with a first dopant, and an active layer disposed between the n-doped first layer and the p-doped second layer and having at least one quantum well. The active layer of the semiconductor structure is divided into a plurality of first optically active regions, at least one second region, and at least one third region. Here, the plurality of first optically active regions are arranged in a hexagonal pattern spaced apart from each other. The at least one quantum well in the active region comprises a larger band gap in the at least one second region than in the plurality of first optically active regions and the at least one third region, the band gap being modified, in particular, by quantum well intermixing. The at least one second region encloses the plurality of first optically active regions.
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公开(公告)号:US12199222B2
公开(公告)日:2025-01-14
申请号:US17824429
申请日:2022-05-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Xue Wang , Petrus Sundgren , Laura Kreiner
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号:US20220172976A1
公开(公告)日:2022-06-02
申请号:US17607804
申请日:2020-04-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Andreas Biebersdorf , Stefan Illek , Christoph Klemp , Felix Feix , Ines Pietzonka , Petrus Sundgren , Christian Berger , Ana Kanevce , Karl Engl
IPC: H01L21/683 , H01L25/075
Abstract: In an embodiment an arrangement includes a plurality of semiconductor chips arranged on a carrier, wherein the carrier is a growth substrate or an auxiliary carrier, wherein the semiconductor chips are arranged at grid points of a grid, and wherein the grid is a hexagonal grid deformed by a deformation factor along at least one of a plurality of axes of the grid and has a shearing along at least one of the plurality of axes of the grid.
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公开(公告)号:US20190214364A1
公开(公告)日:2019-07-11
申请号:US16329449
申请日:2017-08-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Philipp Kreuter , Andreas Biebersdorf , Christoph Klemp , Jens Ebbecke , Ines Pietzonka , Petrus Sundgren
IPC: H01L23/00
Abstract: A method of aligning semiconductor chips in a medium includes providing an electrically insulating liquid medium; providing semiconductor chips; forming a suspension with the medium and the semiconductor chips; exposing the semiconductor chips to electromagnetic radiation that generates free charge carriers in the semiconductor chips; arranging the suspension in an electric field in which the semiconductor chips are aligned along the electric field; and curing the medium after aligning the semiconductor chips.
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