公开(公告)号：BR9910762A

公开(公告)日：2001-02-13

申请号：BR9910762

申请日：1999-03-11

Applicant: OSRAM SYLVANIA INC

Inventor： DOIKAS PETER ,  GEIS DAVID ,  MERWIN JEFFREY D

IPC: H01R12/04 ,  H01R43/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H01R9/00

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

公开(公告)号：EP1092248A4

公开(公告)日：2001-08-22

申请号：EP99912421

申请日：1999-03-11

Applicant: OSRAM SYLVANIA INC

Inventor： DOIKAS PETER ,  GEIS DAVID ,  MERWIN JEFFREY D

IPC: H01R12/04 ,  H01R43/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/44 ,  H01R9/00 ,  B21K1/62 ,  H01L21/48 ,  H01L23/498 ,  H05K3/36

CPC classification number: H05K3/4038 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.